16 – Innovator in Electronics

C-29-C

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urata.com

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Applic Ation Speci F ic cA pA cit or S

High Frequency Ceramic Capacitors

GJM Soldering and Mounting

3. Reflow Soldering

When sudden heat is applied to the components, the

mechanical strength of the components should go down

because remarkable temperature change causes

deformity inside components. In order to prevent

mechanical damage in the components, preheating should

be required for both of the components and the PCB board.

Preheating conditions are shown in Table 1. It is required to

keep temperature differential between the soldering and

the components surface ( T) as small as possible.

Solderability of Tin plating termination chip might be

deteriorated when low temperature soldering profile where

peak solder temperature is below the Tin melting point is

used. Please confirm the solderability of Tin plating

termination chip before use.

When components are immersed in solvent after mounting,

be sure to maintain the temperature difference ( T)

between the component and solvent within the range

shown in theTable 1.

GRM02/03/15/18/21/31

GJM03/15

LLL15/18/21/31

ERB18/21

GQM18/21

GRM32/43/55

LLA18/21/31

LLM21/31

GNM

ERB32

T 190

T 130

Part Number

Temperature Differential

Table 1

Recommended Conditions

Standard Conditions for Reflow Soldering

Allowable Soldering Temperature and Time

In case of repeated soldering, the accumulated

soldering time must be within the range shown above.

Soldering Time (sec.)

260

270

280

250

240

230

220

0

30

60

90

120

Inverting the PCB

Make sure not to impose an abnormal mechanical shock on

the PCB.

Continued from the preceding page.

Continued on the following page.

Peak Temperature

Atmosphere

Pb-Sn Solder

Infrared Reflow

230-250 C

Air

Vapor Reflow

230-240 C

Air

Lead Free Solder

240-260 C

Infrared Reflow

Vapor Reflow

60-120 seconds 30-60 seconds

T

Gradual

Cooling

Soldering

Preheating

200 C

170 C

150 C

130 C

Time

Temperature ( )

Peak Temperature

60-120 seconds 20 seconds max.

T

Gradual

Cooling

Soldering

Preheating

170 C

150 C

130 C

Time

Temperature ( )

Peak Temperature

Pb-Sn Solder: Sn-37Pb

Lead Free Solder: Sn-3.0Ag-0.5Cu

Optimum Solder Amount for Reflow Soldering

Overly thick application of solder paste results in

excessive fillet height solder.

This makes the chip more susceptible to mechanical

and thermal stress on the board and may cause

cracked chips.

Too little solder paste results in a lack of adhesive

strength on the outer electrode, which may result in

chips breaking loose from the PCB.

Make sure the solder has been applied smoothly to the

end surface to a height of 0.2mm min.

Optimum Solder Amount for Reflow Soldering

0.2mm min.

Caution

13

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

84

• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our

sales representatives or product engineers before ordering.

• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Note

C02E.pdf

07.2.6

GJM03/15

Reflow Soldering

When sudden heat is applied to the components, the

mechanical strength of the components should go down

because remarkable temperature change causes

deformity inside components. In order to prevent

mechanical damage in the components, preheating should

be required for both of the components and the PCB board.

Preheating conditions are shown in Table 1. It is required to

keep temperature differential between the soldering and

the components surface ( T) as small as possible.

Solderability of Tin plating termination chip might be

deteriorated when low temperature soldering profile where

peak solder temperature is below the Tin melting point is

used. Please confirm the solderability of Tin plating

termination chip before use.

When components are immersed in solvent after mounting,

be sure to maintain the temperature difference ( T)

between the component and solvent within the range

shown in the Table 1.

GRM02/03/15/18/21/31

GJM03/15

ERB18/21

GQM18/21

GRM32/43/55

GNM

ERB32

T 190

T 130

Part Number

Temperature Differential

Table 1

Recommended Conditions

Standard Conditions for Reflow Soldering

Allowable Soldering Temperature and Time

In case of repeated soldering, the accumulated

soldering time must be within the range shown above.

Soldering Time (sec.)

260

270

280

250

240

230

220

0

30

60

90

120

Inverting the PCB

Make sure not to impose an abnormal mechanical shock on

the PCB.

Continued on the following page.

Peak Temperature

Atmosphere

Pb-Sn Solder

Infrared Reflow

230-250 C

Air

Vapor Reflow

230-240 C

Air

Lead Free Solder

240-260 C

Infrared Reflow

Vapor Reflow

60-120 seconds 30-60 seconds

T

Gradual

Cooling

Soldering

Preheating

200 C

170 C

150 C

130 C

Time

Temperature ( )

Peak Temperature

60-120 seconds

20 seconds max.

T

Gradual

Cooling

Soldering

Preheating

170 C

150 C

130 C

Time

Temperature ( )

Peak Temperature

Pb-Sn Solder: Sn-37Pb

Lead Free Solder: Sn-3.0Ag-0.5Cu

Optimum Solder Amount for Reflow Soldering

Overly thick application of solder paste results in

excessive fillet height solder.

This makes the chip more susceptible to mechanical

and thermal stress on the board and may cause

cracked chips.

Too little solder paste results in a lack of adhesive

strength on the outer electrode, which may result in

chips breaking loose from the PCB.

Make sure the solder has been applied smoothly to the

end surface to a height of 0.2mm min.

Optimum Solder Amount for Reflow Soldering

0.2mm min.

Reflow Soldering

When sudden heat is applied to the components, the

mechanical strength of the components should go down

because remarkable temperature change causes

deformity inside components. In order to prevent

mechanical damage in the components, preheating should

be required for both of the components and the PCB board.

Preheating conditions are shown in Table 1. It is required to

keep temperature differential between the soldering and

the components surface ( T) as small as possible.

Solderability of Tin plating termination chip might be

deteriorated when low temperature soldering profile where

peak solder temperature is below the Tin melting point is

used. Please confirm the solderability of Tin plating

termination chip before use.

When components are immersed in solvent after mounting,

be sure to maintain the temperature difference ( T)

between the component and solvent within the range

shown in the Table 1.

GRM02/03/15/18/21/31

GJM03/15

ERB18/21

GQM18/21

GRM32/43/55

GNM

ERB32

T 190

T 130

Part Number

Temperature Differential

Table 1

Recommended Conditions

Standard Conditions for Reflow Soldering

Allowable Soldering Temperature and Time

In case of repeated soldering, the accumulated

soldering time must be within the range shown above.

Soldering Time (sec.)

260

270

280

250

240

230

220

0

30

60

90

120

Inverting the PCB

Make sure not to impose an abnormal mechanical shock on

the PCB.

Continued on the following page.

Peak Temperature

Atmosphere

Pb-Sn Solder

Infrared Reflow

230-250 C

Air

Vapor Reflow

230-240 C

Air

Lead Free Solder

240-260 C

Infrared Reflow

Vapor Reflow

60-120 seconds 30-60 seconds

T

Gradual

Cooling

Soldering

Preheating

200 C

170 C

150 C

130 C

Time

Temperature ( )

Peak Temperature

60-120 seconds

20 seconds max.

T

Gradual

Cooling

Soldering

Preheating

170 C

150 C

130 C

Time

Temperature ( )

Peak Temperature

Pb-Sn Solder: Sn-37Pb

Lead Free Solder: Sn-3.0Ag-0.5Cu

Optimum Solder Amount for Reflow Soldering

Overly thick application of solder paste results in

excessive fillet height solder.

This makes the chip more susceptible to mechanical

and thermal stress on the board and may cause

cracked chips.

Too little solder paste results in a lack of adhesive

strength on the outer electrode, which may result in

chips breaking loose from the PCB.

Make sure the solder has been applied smoothly to the

end surface to a height of 0.2mm min.

Optimum Solder Amount for Reflow Soldering

0.2mm min.