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LP3879MR-1.0 Datasheet(PDF) 3 Page - Texas Instruments

Part # LP3879MR-1.0
Description  LP3879 Micropower 800mA Low Noise "Ceramic Stable" Voltage Regulator for Low
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

LP3879MR-1.0 Datasheet(HTML) 3 Page - Texas Instruments

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The value of
θJ−A for the WSON and SO PowerPad packages are specifically dependent on PCB trace area,
LP3879
www.ti.com
SNVS396B – MAY 2006 – REVISED APRIL 2013
Absolute Maximum Ratings
(1) (2)
Storage Temperature Range
−65°C to +150°C
Operating Junction Temperature Range
-40°C to +125°C
Lead Temperature (Soldering, 5 seconds)
260°C
ESD Rating(3)
2 kV
Shutdown Pin
1kV
Power Dissipation(4)
Internally Limited
Input Supply Voltage (Survival)
−0.3V to +16V
Input Supply Voltage (Typical Operating)
2.5V to +6V
SENSE Pin
−0.3V to +6V
Output Voltage (Survival)(5)
−0.3V to +6V
IOUT (Survival)
Short Circuit Protected
Input-Output Voltage (Survival)(6)
−0.3V to +16V
(1)
Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Electrical specifications do not apply
when operating the device outside of its rated operating conditions.
(2)
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3)
ESD testing was performed using Human Body Model, a 100 pF capacitor discharged through a 1.5 k
Ω resistor.
(4)
The maximum allowable power dissipation is a function of the maximum junction temperature, TJ(MAX), the junction-to-ambient thermal
resistance,
θJ−A, and the ambient temperature, TA. The maximum allowable power dissipation at any ambient temperature is calculated
trace material, and the number of layers and thermal vias. If a four layer board is used with maximum vias from the IC center to the heat
dissipating copper layers, values of
θJ−A which can be obtained are approximately 60°C/W for the SO PowerPad and 40°C/W for the
WSON package. Exceeding the maximum allowable power dissipation will cause excessive die temperature, and the regulator will go
into thermal shutdown.
(5)
If used in a dual-supply system where the regulator load is returned to a negative supply, the LP3879 output must be diode-clamped to
ground.
(6)
The output PNP structure contains a diode between the VIN and VOUT terminals that is normally reverse-biased. Forcing the output
above the input will turn on this diode and may induce a latch-up mode which can damage the part (see Application Hints).
Copyright © 2006–2013, Texas Instruments Incorporated
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