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RT0603DRB07470RL Datasheet(PDF) 8 Page - YAGEO Corporation

Part # RT0603DRB07470RL
Description  THIN FILM CHIP RESISTORS High precision - high stability
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Manufacturer  YAGEO [YAGEO Corporation]
Direct Link  http://www.yageo.com
Logo YAGEO - YAGEO Corporation

RT0603DRB07470RL Datasheet(HTML) 8 Page - YAGEO Corporation

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Chip Resistor Surface Mount
www.yageo.com
Oct 21, 2009 V.4
Product specification
8
10
SERIES
RT
0402 to 2512 (RoHS Compliant)
TEST
TEST METHOD
PROCEDURE
REQUIREMENTS
Short Time Overload
IEC60115-1 4.13
2.5 times of rated voltage or maximum
overload voltage whichever is less for 5 sec at
room temperature
±(0.5%+0.05 Ω)
No visible damage
Board Flex/
Bending
IEC 60068-2-21
Chips mounted on a 90mm glass epoxy resin
PCB (FR4)
Bending: see table 6 for each size
Bending time: 60±5 seconds
±(0.25%+0.05 Ω)
No visible damage
Low Temperature
Operation
IEC 60068-2-1
The resistor shall be subjected to a DC rated
voltage for 1.5 h-on, 0.5 h-off, at -55±3 °C
This constitutes shall be repeated for 96 hours
However the applied voltage shall not exceed
the maximum operating voltage
±(0.5%+0.05 Ω)
No visible damage
Insulation Resistance
IEC 60115-1 4.6
Rated continuous overload voltage (RCOV)
for 1 minute
Details see below table 5
≥10 GΩ
Dielectric Withstand
Voltage
IEC 60115-1 4.7
Maximum voltage (Vrms) applied for 1 minute
Details see below table 5
No breakdown or flashover
Solderability
- Wetting
IPC/JEDEC J-STD-002B test B
Electrical Test not required
Magnification 50X
SMD conditions:
1st step: method B, aging 4 hours at 155°C
dry heat
2nd step: leadfree solder bath at 245±3°C
Dipping time: 3±0.5 seconds
Well tinned (≥95%
covered)
No visible damage
- Leaching
IPC/JEDEC J-STD-002B test D
Leadfree solder, 260 °C, 30 seconds
immersion time
No visible damage
- Resistance to
Soldering Heat
IEC 60068-2-58
Condition B, no pre-heat of samples.
Leadfree solder, 260 °C, 10 seconds
immersion time
Procedure 2 for SMD: devices fluxed and
cleaned with isopropanol
±(0.5%+0.05 Ω)
No visible damage


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