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DHG10I1200PM Datasheet(PDF) 2 Page - IXYS Corporation |
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DHG10I1200PM Datasheet(HTML) 2 Page - IXYS Corporation |
2 / 2 page DHG 10 I 1200PM advanced I RMS A per pin* 35 R thCH K/W 0.50 M D Nm 0.6 mounting torque 0.4 T stg °C 150 storage temperature -55 Weight g 2 Symbol Definition Ratings typ. max. min. Conditions RMS current thermal resistance case to heatsink Unit * Irms is typically limited by: 1. pin-to-chip resistance; or by 2. current capability of the chip. In case of 1, a common cathode/anode configuration and a non-isolated backside, the whole current capability can be used by connecting the backside. Outlines TO-220FPAC F C N 60 mounting force with clip 20 IXYS reserves the right to change limits, conditions and dimensions. © 2006 IXYS all rights reserved * Data according to IEC 60747and per diode unless otherwise specified |
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