DHG 10 I 1200PM

advanced

I

RMS

A

per pin*

35

R

thCH

K/W

0.50

M

D

Nm

0.6

mounting torque

0.4

T

stg

°C

150

storage temperature

-55

Weight

g

2

Symbol

Definition

Ratings

typ.

max.

min.

Conditions

RMS current

thermal resistance case to heatsink

Unit

* Irms is typically limited by: 1. pin-to-chip resistance; or by 2. current capability of the chip.

In case of 1, a common cathode/anode configuration and a non-isolated backside, the whole current capability can be used by connecting

the backside.

Outlines TO-220FPAC

F

C

N

60

mounting force with clip

20

IXYS reserves the right to change limits, conditions and dimensions.

© 2006 IXYS all rights reserved

* Data according to IEC 60747and per diode unless otherwise specified