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CIC21P300 Datasheet(PDF) 1 Page - Samsung semiconductor |
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CIC21P300 Datasheet(HTML) 1 Page - Samsung semiconductor |
1 / 10 page Chip Bead ; CIC/CIS Series For High Current LW t d 1.0 ±0.05 1.6 ±0.15 2.0 ±0.2 3.2 ±0.2 3.2 ±0.2 4.5 ±0.2 4.5 ±0.2 SIZE CODE 0.5 ±0.05 0.8 ±0.15 1.25 ±0.2 1.6 ±0.2 2.5 ±0.2 1.6 ±0.2 3.2 ±0.2 0.5 ±0.05 0.8 ±0.15 0.9 ±0.2 1.1 ±0.2 1.3 ±0.2 1.6 ±0.2 / 1.2±0.2 1.5 ±0.2 0.25 ±0.1 0.3 ±0.2 0.5 +0.2,-0.3 0.5 +0.2,-0.3 0.5 ±0.3 0.5 ±0.3 0.5 ±0.3 05 10 21 31 32 41 43 (1) Chip Beads (2) C: For high current ~3A, S: Ultra high current ~6A (3) Dimension (4) Material Code(J, P) (5) Nominal impedance(310: 31 Ω, 121: 120Ω) (6) Thickness option(N: Standard, A: Thinner than standard, B: Thicker than standard) (7) Packaging(C: paper tape, E: embossed tape) CI C 05 P 300 N C L W t d (1) (2) (3) (4) (5) (6) (7) Unit : mm Ferrite Body External Electrode The CIC/CIS Series can be used in high current owing to their low DC resistance. They can match power lines to a maximum of 6A DC. Part Numbering •The smallest beads used for high current. (CIC: ~3A, CIS: ~6A) Feature •Suppression of noise in power line Application Dimensions Operating Temp Storage Temp -55~+125 ℃ -10~+40 ℃ |
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