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8468-21B1-RK-TR Datasheet(PDF) 1 Page - 3M Electronics |
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8468-21B1-RK-TR Datasheet(HTML) 1 Page - 3M Electronics |
1 / 3 page 3 Electronic Solutions Division Interconnect Solutions http://www.3Mconnectors.com 3M is a trademark of 3M Company. For technical, sales or ordering information call 800-225-5373 3M™ Chip Carrier Sockets Surfacemount 8400 Series • Accepts chip carriers conforming to JEDEC outline MO-047 for square and MO-052 for rectangular • High temperature insulator compatible with IR reflow and wave soldering • Compatible with automated loading equipment • Open top design allows unrestricted air flow • Molded slots for ease of device extraction • Available with optional PCB locating posts • RoHS Compliant. See the Regulatory Information Appendix (RIA) in the "RoHS Compliance" section of www.3Mconnector.com for compliance information (RIA E1 and C1 apply) Date Modified: September 14, 2011 TS-2147-B Sheet 1 of 2 Physical Insulation Material: Glass Filled Polyphenylene Sulfide (PPS) Flammability: UL 94V-0 Color: Black Contact Material: Copper Alloy Plating Underplating: 50 µ" [ 1.27 µm ] Nickel - Overall Wiping Area: 160 µ", [ 4.06 µm ] Matte Tin Electrical Contact Resistance: 15 mΩ Insulation Resistance: >103 MΩ minimum Capacitance: <1 pF at 1 MHz Environmental Temperature Rating: -40ºC to +105ºC Process Rating: Maximum 260°C, single pass, (profile per J-STD-020C) Moisture Sensitivity Level: 1 (per J-STD-020C) Notice: Please be aware that the 3M PLCC products are tin plated on the contact wiping surface. This is necessary to ensure mated reliability since standard PLCC contacts are also tin plated. Since tin whiskers are an inherent characteristic of tin and mechanically stressing the tin is a known driver of whisker growth, it is possible the PLCC and PLCC socket may exhibit tin whisker growth after mating. 3M follows the iNEMI plating recommendations which include whisker mitigating tin plating chemistry to reduce the likelihood of tin whisker growth. Please consider whether a PLCC socket is suitable for your particular needs after considering your product applications life span and environment including mechanical stresses, humidity, and thermal cycling all of which have been shown to stimulate tin whisker growth. |
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