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HSMS-2800-BLKG Datasheet(PDF) 6 Page - AVAGO TECHNOLOGIES LIMITED |
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HSMS-2800-BLKG Datasheet(HTML) 6 Page - AVAGO TECHNOLOGIES LIMITED |
6 / 10 page 6 Figure 8. Surface Mount Assembly Profile. 25 Time Tp T L tp t L t 25 ° C to Peak Ramp-up ts Ts min Ramp-down Preheat Critical Zone T L to Tp Ts max Lead-Free Reflow Profile Recommendation (IPC/JEDEC J-STD-020C) Reflow Parameter Lead-Free Assembly Average ramp-up rate (Liquidus Temperature (TS(max) to Peak) 3°C/ second max Preheat Temperature Min (TS(min)) 150°C Temperature Max (TS(max)) 200°C Time (min to max) (tS) 60-180 seconds Ts(max) to TL Ramp-up Rate 3°C/second max Time maintained above: Temperature (TL) 217°C Time (tL) 60-150 seconds Peak Temperature (TP) 260 +0/-5°C Time within 5 °C of actual Peak temperature (tP) 20-40 seconds Ramp-down Rate 6°C/second max Time 25 °C to Peak Temperature 8 minutes max Note 1: All temperatures refer to topside of the package, measured on the package body surface SMT Assembly Reliable assembly of surface mount components is a complex process that involves many material, process, and equipment factors, including: method of heating (e.g., IR or vapor phase reflow, wave soldering, etc.) circuit board material, conductor thickness and pattern, type of solder alloy, and the thermal conductivity and thermal mass of components. Components with a low mass, such as the SOT package, will reach solder reflow temperatures faster than those with a greater mass. Avago’s SOT diodes have been qualified to the time- temperature profile shown in Figure 8. This profile is representative of an IR reflow type of surface mount as- sembly process. After ramping up from room temperature, the circuit board with components attached to it (held in place with solder paste) passes through one or more preheat zones. The preheat zones increase the temperature of the board and components to prevent thermal shock and begin evaporating solvents from the solder paste. The reflow zone briefly elevates the temperature sufficiently to produce a reflow of the solder. The rates of change of temperature for the ramp-up and cool-down zones are chosen to be low enough to not cause deformation of the board or damage to compo- nents due to thermal shock. The maximum temperature in the reflow zone (TMAX) should not exceed 260°C. These parameters are typical for a surface mount assem- bly process for Avago diodes. As a general guideline, the circuit board and components should be exposed only to the minimum temperatures and times necessary to achieve a uniform reflow of solder. |
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