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TS68302MA16 Datasheet(PDF) 8 Page - ATMEL Corporation |
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TS68302MA16 Datasheet(HTML) 8 Page - ATMEL Corporation |
8 / 47 page 8 TS68302 2117A–HIREL–11/02 This device contains protective circuitry to protect the inputs against damage due to high static voltages or electrical fields; however, it is advised that normal precautions be taken to avoid application of any voltages higher than maximum-rated voltages to this high-impedance circuit. Reliability of operation is enhanced if unused inputs are tied to an appropriate logic voltage level (e.g., either GND or V DD). Figure 5. Clock Input Timing Diagram Note: Timing measurements are referenced to and from a low voltage of 0.8V and a voltage of 2.0V, unless otherwise noted. The volt- age swing through this range should start outside, and pass through, the range such that the rise or fall will be linear between 0.8V and 2.0V. Power Considerations The average chip-junction temperature, TJ, in °C can be obtained from: TJ = TA + (PD ⋅ θJA) (1) TA = Ambient Temperature, °C θ JA = Package Thermal Resistance, Junction-to-Ambient, °C/W PD = PINT + PI/O PINT = ICC ⋅ VCC, Watts - Chip Internal Power PI/O = Power Dissipation on Input and Output pins - user determined Note: For T A = 70°C and PD = 0.5 W at 12.5 MHz Tj = 88°C. For most applications P I/O < 0,30 PINT and can be neglected. An approximate relationship between P D and TJ (if PI/O is neglected) is: P D = K ÷ (TJ + 273) (2) Solving equations (1) and (2) for K gives: K = P D ⋅ (TA + 273) + θJA ⋅ PD2 (3) where K is a constant pertaining to the particular part. K can be determined from equa- tion (3) by measuring P D (at equilibrium) for a known TA. Using this value of K, the values of P D and TJ can be obtained by solving equations (1) and (2) iteratively for any value of T A. 2.0V 0.8V tr (C) tf (C) tcyc Table 4. Thermal Characteristics at 25°C Package Symbol Parameter Value Unit PGA 132 θ JA θ JC Thermal Resistance - Ceramic Junction To Ambient Thermal Resistance - Ceramic Junction To Case 33 5 °C/W °C/W CERQUAD 132 θ JA θ JC Thermal Resistance - Ceramic Junction To Ambient Thermal Resistance - Ceramic Junction To Case 46 2 °C/W °C/W |
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