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LXZ1-PL01-0064 Datasheet(PDF) 9 Page - List of Unclassifed Manufacturers |
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LXZ1-PL01-0064 Datasheet(HTML) 9 Page - List of Unclassifed Manufacturers |
9 / 28 page LUXEON Z Datasheet DS105 20120516 9 Table 8. Profile Feature Lead Free Assembly Average Ramp-Up Rate (Ts max to Tp) 3°C / second max Preheat Temperature Min (Ts min) 150°C Preheat Temperature Max (Ts max) 200°C Preheat Time (ts min to tsmax) 60 - 180 seconds Temperature T L (tL) 217°C Time Maintained Above Temperature T L (tL) 60 - 150 seconds Peak / Classification Temperature (T P) 260°C Time Within 5°C of Actual Peak Temperature (t P) 20 - 40 seconds Ramp-Down Rate 6°C / second max Time 25°C to Peak Temperature 8 minutes max Note for Table 8: - All temperatures refer to the application Printed Circuit Board (PCB), measured on the surface adjacent to the package body. Reflow Soldering Characteristics JEDEC 020c |
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