LXML-PWC2 datasheet(9/33 Pages) ETC1

Part #	LXML-PWC2

Description	Leading efficacy and light output, maximum design flexibility

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8

Reflow Soldering Characteristics

Temperature profile for Table 8.

Table 8.

Profile Feature

Lead Free Assembly

AverageRamp-UpRate(Ts

maxtoTp)

3°C/secondmax

PreheatTemperatureMin(Ts

min)

150°C

PreheatTemperatureMax(Ts

max)

200°C

PreheatTime(ts

mintotsmax)

60-180seconds

Temperature(T

L)

217°C

TimeMaintainedAboveTemperature(T

L)

60-150seconds

Peak/ClassificationTemperature(T

P)

260°C

TimeWithin5°CofActualPeakTemperature(t

P)

20-40seconds

Ramp-DownRate

6°C/secondmax

Time25°CtoPeakTemperature

8minutesmax

Notes for Table 8:

1. AlltemperaturesrefertotheapplicationPrintedCircuitBoard(PCB),measuredonthesurfaceadjacenttothepackagebody.

2. ForadditionalinformationonthermalmeasurementguidelinespleaserefertoApplicationBriefAB33.

JEDEC 020c

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