< Dual-In-Line Package Intelligent Power Module >

PSS20S71F6

TRANSFER MOLDING TYPE

INSULATED TYPE

Publication Date : December 2013

2

INVERTER PART

Symbol

Parameter

Condition

Ratings

Unit

Supply voltage

Applied between P-NU,NV,NW

450

V

Supply voltage (surge)

Applied between P-NU,NV,NW

500

V

Collector-emitter voltage

600

V

Each IGBT collector current

20

A

Each IGBT collector current (peak)

40

A

Collector dissipation

76.9

W

Junction temperature

-20~+150

°C

CONTROL (PROTECTION) PART

Symbol

Parameter

Condition

Ratings

Unit

Control supply voltage

20

V

Control supply voltage

20

V

Input voltage

V

Fault output supply voltage

V

Fault output current

1

mA

Current sensing input voltage

V

TOTAL SYSTEM

Symbol

Parameter

Condition

Ratings

Unit

Self protection supply voltage limit

(Short circuit protection capability)

μs

400

V

Module case operation temperature

Measurement point of Tc is provided in Fig.1

-20~+100

°C

Storage temperature

-40~+125

°C

Isolation voltage

60Hz, Sinusoidal, AC 1min, between connected all pins

and heat sink plate

2500

THERMAL RESISTANCE

Symbol

Parameter

Condition

Limits

Unit

Min.

Typ.

Max.

Junction to case thermal

resistance

(Note 1)

Inverter IGBT part (per 1/6 module)

-

-

1.3

K/W

Inverter FWDi part (per 1/6 module)

-

-

3.0

K/W

Note 1: Grease with good thermal conductivity and long-

term endurance should be applied evenly with about +100μm~+200μm on the contacting surface of

DIPIPM and heat sink. The contacting thermal resistance between DIPIPM case and heat sink Rth(c-f) is determined by the thickness and the thermal

conductivity of the applied grease. For reference, Rth(c-f) is about 0.3K

/W (per 1/6 module, grease thickness: 20μm, thermal conductivity: 1.0W/m•k).

Control terminals

Tc point

IGBT chip position

FWDi chip position

Power terminals

Heat sink side

Groove

17.7mm

18mm