LP38851

www.ti.com

SNVS492C – JUNE 2007 – REVISED APRIL 2013

PIN DESCRIPTIONS (continued)

SFM

PFM

SO PowerPad

Pin

Pin Description

Pin #

Pin #

Pin #

Symbol

The SO PowerPad DAP is a thermal connection only that is

physically attached to the backside of the die, and used as a

-

-

DAP

DAP

thermal heat-sink connection. See APPLICATION INFORMATION

for details.

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

ABSOLUTE MAXIMUM RATINGS

(1)

Storage Temperature Range

−65°C to +150°C

Lead Temperature

Soldering, 5 seconds

260°C

ESD Rating

±2 kV

Internally Limited

−0.3V to +6.0V

−0.3V to +6.0V

−0.3V to +6.0V

−0.3V to +6.0V

Internally Limited

Junction Temperature

−40°C to +150°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but does not ensure specific performance limits. For specifications and conditions, see the

Electrical Characteristics.

(2)

The human body model is a 100 pF capacitor discharged through a 1.5k resistor into each pin. Test method is per JESD22-A114.

(3)

ambient thermal resistance (

exceed the maximum operating rating. See APPLICATION INFORMATION for details.

OPERATING RATINGS

(1)

0.8V

3.0V to 5.5V

4.5V to 5.5V

0 mA to 800 mA

−40°C to +125°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but does not ensure specific performance limits. For specifications and conditions, see the

Electrical Characteristics.

(2)

ambient thermal resistance (

exceed the maximum operating rating. See APPLICATION INFORMATION for details.

Copyright © 2007–2013, Texas Instruments Incorporated

Submit Documentation Feedback

3

Product Folder Links: LP38851