General Purpose Surface

Mounted Resistors

WCR Series

www.bitechnologies.com www.irctt.com www.welwyn-tt.com

General Note

TT electronics reserves the right to make changes in product specification without notice or liability.

All information is subject to TT electronics’ own data and is considered accurate at time of going to print.

© TT electronics plc

07.13

General Purpose Surface

Mounted Resistors

WCR Series

Excellent reliability

Wide range of sizes and ohmic values

Wrap around terminations

Inner electrode protection

General Note

Welwyn Components reserves the right to make changes in product specification without notice or liability.

All information is subject to Welwyn’s own data and is considered accurate at time of going to print.

Telephone: +44 (0) 1670 822181 · Facsimile: +44 (0) 1670 829465 · Email: info@welwyn-tt.com · Website: www.welwyn-tt.com

Iss 07.03

A subsidiary of

TT electronics plc

Welwyn Components

* Notes – TCR for low values 1R to 10R: -400 to +600ppm/ºC, 11R to 100R: ±200ppm/ºC

TCR for high values 3M3 to 10M: ±300ppm/º

1

200

25

50

Power rating @ 70

°C

watts

Resistance range

ohms

Limiting element votage

volts

TCR*

ppm/

°C

Resistance Tolerance

%

Zero-ohm Jumper Chip Rating

amps

0.05

0201

10R to 1M0 1R0 to 1M0

0.5

0.25

1210

1R0 to 10M

0.063

0402

<50

1.5

2

0.1

0603

0.125

0805

150

0.25

1206

0.5

2010

1.0

2512

E24 or E96

-55 to 155

Standard values

Ambient temperature range

°C

Zero-ohm Jumper Chip Resistance milliohms

1

250

100

200

Electrical Data

W

0.3 ± 0.03

0.5 ± 0.05

0.8 ± 0.15

1.25+ 0.2 -0.1

1.6 + 0.1 -0.15

2.6 ± 0.15

2.5 ± 0.15

3.2 ± 0.15

L

0.6 ± 0.03

1.0 ± 0.1

1.6 ± 0.15

2.0 ± 0.2

3.2 +0.1 -0.25

3.2 + 0.1 -0.2

5.0 ± 0.15

6.3 ± 0.15

T

0.23 ± 0.03

0.35 ± 0.05

0.5 ± 0.15

0.5 + 0.15 -0.10

0.55 +0.15 -0.1

0.55 +0.15 -0.1

0.56 ± 0.15

0.56 ± 0.15

C

0.12 ± 0.05

0.2 ± 0.1

0.25 ± 0.2

0.4 ± 0.2

0.5 + 0.2-0.25

0.5 ± 0.25

0.60 ± 0.25

0.60 ± 0.25

A

0.15 ± 0.05

0.25 ± 0.1

0.25 ± 0.2

0.4 ± 0.2

0.5+ 0.2 -0.25

0.5 ± 0.2

0.60 ± 0.25

1.2 ± 0.85

T

W

A

A

L

Wrap-around terminations

(3 faces)

C

Style

0201

0402

0603

0805

1206

1210

2010

2512

Dimensions (mm)

Physical Data

Construction

The chips have a high alumina substrate (96% minimum) with

a ruthenium oxide resistance element and silver palladium,

nickel and tin plated terminations. A glazed protection coat

is applied to the resistive element (See Fig.1)

Terminations

Solderability

The terminations meet the requirements of

IEC 115-1, Clause 4.17.3.2.

Strength

The terminations meet requirements of

IEC 68.2.21.

Figure 1

Tin Plating

Nickel Barrier

Dipped Conductor

Silver

Palladium

96% min Alumina Substrate

Epoxy Melamine

Glass Dielectric

Resistance Element

Protection

General Purpose Surface

Mounted Resistors

WCR Series

Excellent reliability

Wide range of sizes and ohmic values

Wrap around terminations

Inner electrode protection

General Note

Welwyn Components reserves the right to make changes in product specification without notice or liability.

All information is subject to Welwyn’s own data and is considered accurate at time of going to print.

Telephone: +44 (0) 1670 822181 · Facsimile: +44 (0) 1670 829465 · Email: info@welwyn-tt.com · Website: www.welwyn-tt.com

Iss 07.03

A subsidiary of

TT electronics plc

Welwyn Components

* Notes – TCR for low values 1R to 10R: -400 to +600ppm/ºC, 11R to 100R: ±200ppm/ºC

TCR for high values 3M3 to 10M: ±300ppm/º

1

200

25

50

Power rating @ 70

°C

watts

Resistance range

ohms

Limiting element votage

volts

TCR*

ppm/

°C

Resistance Tolerance

%

Zero-ohm Jumper Chip Rating

amps

0.05

0201

10R to 1M0 1R0 to 1M0

0.5

0.25

1210

1R0 to 10M

0.063

0402

<50

1.5

2

0.1

0603

0.125

0805

150

0.25

1206

0.5

2010

1.0

2512

E24 or E96

-55 to 155

Standard values

Ambient temperature range

°C

Zero-ohm Jumper Chip Resistance milliohms

1

250

100

200

Electrical Data

W

0.3 ± 0.03

0.5 ± 0.05

0.8 ± 0.15

1.25+ 0.2 -0.1

1.6 + 0.1 -0.15

2.6 ± 0.15

2.5 ± 0.15

3.2 ± 0.15

L

0.6 ± 0.03

1.0 ± 0.1

1.6 ± 0.15

2.0 ± 0.2

3.2 +0.1 -0.25

3.2 + 0.1 -0.2

5.0 ± 0.15

6.3 ± 0.15

T

0.23 ± 0.03

0.35 ± 0.05

0.5 ± 0.15

0.5 + 0.15 -0.10

0.55 +0.15 -0.1

0.55 +0.15 -0.1

0.56 ± 0.15

0.56 ± 0.15

C

0.12 ± 0.05

0.2 ± 0.1

0.25 ± 0.2

0.4 ± 0.2

0.5 + 0.2-0.25

0.5 ± 0.25

0.60 ± 0.25

0.60 ± 0.25

A

0.15 ± 0.05

0.25 ± 0.1

0.25 ± 0.2

0.4 ± 0.2

0.5+ 0.2 -0.25

0.5 ± 0.2

0.60 ± 0.25

1.2 ± 0.85

T

W

A

A

L

Wrap-around terminations

(3 faces)

C

Style

0201

0402

0603

0805

1206

1210

2010

2512

Dimensions (mm)

Physical Data

Construction

The chips have a high alumina substrate (96% minimum) with

a ruthenium oxide resistance element and silver palladium,

nickel and tin plated terminations. A glazed protection coat

is applied to the resistive element (See Fig.1)

Terminations

Solderability

The terminations meet the requirements of

IEC 115-1, Clause 4.17.3.2.

Strength

The terminations meet requirements of

IEC 68.2.21.

Figure 1

Tin Plating

Nickel Barrier

Dipped Conductor

Silver

Palladium

96% min Alumina Substrate

Epoxy Melamine

Glass Dielectric

Resistance Element

Protection