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UCC28703DBVR Datasheet(PDF) 3 Page - Texas Instruments |
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UCC28703DBVR Datasheet(HTML) 3 Page - Texas Instruments |
3 / 31 page UCC28700, UCC28701 UCC28702, UCC28703 www.ti.com SLUSB41 – JULY 2012 RECOMMENDED OPERATING CONDITIONS over operating free-air temperature range (unless otherwise noted) MIN TYP MAX UNIT VDD Bias supply operating voltage 9 35 V CVDD VDD bypass capacitor 0.047 1 µF RCBC Cable-compensation resistance 10 k Ω IVS VS pin current −1 mA TJ Operating junction temperature −20 125 °C THERMAL INFORMATION UCC28700/1/2/3 THERMAL METRIC(1) DBV UNITS 6 PINS θJA Junction-to-ambient thermal resistance(2) 180.0 θJCtop Junction-to-case (top) thermal resistance(3) 71.2 θJB Junction-to-board thermal resistance(4) 44.4 °C/W ψJT Junction-to-top characterization parameter(5) 5.1 ψJB Junction-to-board characterization parameter(6) 43.8 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. (2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as specified in JESD51-7, in an environment described in JESD51-2a. (3) The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC- standard test exists, but a close description can be found in the ANSI SEMI standard G30-88. (4) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB temperature, as described in JESD51-8. (5) The junction-to-top characterization parameter, ψJT, estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining θJA, using a procedure described in JESD51-2a (sections 6 and 7). (6) The junction-to-board characterization parameter, ψJB, estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining θJA , using a procedure described in JESD51-2a (sections 6 and 7). Copyright © 2012, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Link(s): UCC28700, UCC28701 UCC28702, UCC28703 |
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