UCC28700, UCC28701

UCC28702, UCC28703

www.ti.com

SLUSB41 – JULY 2012

RECOMMENDED OPERATING CONDITIONS

over operating free-air temperature range (unless otherwise noted)

MIN

TYP

MAX

UNIT

VDD

Bias supply operating voltage

9

35

V

VDD bypass capacitor

0.047

1

µF

Cable-compensation resistance

10

k

Ω

VS pin current

−1

mA

Operating junction temperature

−20

125

°C

THERMAL INFORMATION

UCC28700/1/2/3

DBV

UNITS

6 PINS

180.0

71.2

44.4

°C/W

5.1

43.8

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

(2)

The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as

specified in JESD51-7, in an environment described in JESD51-2a.

(3)

The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-

standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.

(4)

The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB

temperature, as described in JESD51-8.

(5)

The junction-to-top characterization parameter,

from the simulation data for obtaining

(6)

The junction-to-board characterization parameter,

from the simulation data for obtaining

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