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Document Number: 29044

22

Revision: 09-Mar-11

This datasheet is subject to change without notice.

NTCS0805E3.....T

Vishay BCcomponents

SMD 0805, Glass Protected

NTC Thermistors

SOLDERING CONDITIONS

This SMD thermistor is only suitable for wave or reflow soldering, in accordance with JEDEC J-STD-020. The maximum

temperature of 260 °C during 40 s should not be exceeded.

Typical examples of a soldering processes that will provide reliable joints without damage, are shown below.

TESTS AND REQUIREMENTS

PACKAGING

TAPE SPECIFICATIONS

All tape specifications are in accordance with IEC 60286-3. Basic dimensions are given below. Carrier tape material is paper.

PAPER TAPE

Notes

Time (s)

0

50

100

150

200

200

250

100

150

50

0

300

250

260 °C

 245 °C

215 °C

180 °C

130 °C

2 K/s

40 s

10 s

10 s

Reflow Soldering

Lead (Pb)-free Reflow Soldering Profile

260 °C

≈ 245 °C

235 °C

≈ 170 °C

≈ 120 °C

2 K/s

max.

Time (s)

0

50

100

150

200

350

200

250

100

150

50

0

300

40 s max.

≈ 60 s

20 s min.

normal

limit

250

300

6 K/s

max.

3.0

1.3

1.0

Dimensions of the solder lands

SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT

IEC 60068-2-58

TEST METHOD

TEST

PROCEDURE

REQUIREMENTS

Solderability

2 s at 235 °C

Min. 95 % of surface wetted

Resistance to soldering heat

10 s at 260 °C

R/R <5 %

F

W

P

0

P

2

D

0

B

0

A

0

P

1

E

1

JWB288

T

T

1

DIMENSIONS OF PAPER TAPE in millimeters

PARAMETER

DIMENSION

TOLERANCE

1.7

± 0.2

2.35

± 0.1

W8.0

± 0.2

1.75

± 0.1

F

3.5

± 0.05

1.55

± 0.05

4.0

± 0.1

4.0

± 0.1

2.0

± 0.05

T tape thickness

1.1

Max.

< 0.1

-