3

ADS7862

®

PIN

NAME

DESCRIPTION

1

Reference Input

2

(pin 1) when using internal reference.

3

AGND

Analog Ground

Analog Power Supply, +5VDC. Connect directly to

digital power supply (pin 24). Decouple to analog

ground with a 0.1

µF ceramic capacitor and a 10µF

tantalum capacitor.

5

DB11

Data Bit 11, MSB

6

DB10

Data Bit 10

7

DB9

Data Bit 9

8

DB8

Data Bit 8

9

DB7

Data Bit 7

10

DB6

Data Bit 6

11

DB5

Data Bit 5

12

DB4

Data Bit 4

13

DB3

Data Bit 3

14

DB2

Data Bit 2

15

DB1

Data Bit 1

16

DB0

Data Bit 0, LSB

17

BUSY

HIGH when a conversion is in progress.

18

CONVST

Convert Start

19

CLOCK

An external CMOS-compatible clock can be applied to

the CLOCK input to synchronize the conversion pro-

cess to an external source. The CLOCK pin controls

20

CS

Chip Select

21

RD

Synchronization pulse for the parallel output. During a

Read operation, the first falling edge selects the A

register and the second edge selects the B register,

A0, then controls whether input 0 or input 1 is read.

22

A0

On the falling edge of Convert Start, when A0 is LOW

Channel A0 and Channel B0 are converted and when

it is HIGH, Channel A1 and Channel B1 are converted.

During a Read operation, the first falling edge selects

the A register and the second edge selects the B of RD

register, A0, then controls whether input 0 or input 1 is

read.

23

DGND

Digital Ground. Connect directly to analog ground (pin 3).

24

Digital Power Supply, +5VDC

25

CH B1+

Non-Inverting Input Channel B1

26

CH B1–

Inverting Input Channel B1

27

CH B0+

Non-Inverting Input Channel B0

28

CH B0–

Inverting Input Channel B0

29

CH A1–

Inverting Input Channel A1

30

CH A1+

Non-Inverting Input Channel A1

31

CH A0–

Inverting Input Channel A0

32

CH A0+

Non-Inverting Input Channel A0

PIN CONFIGURATION

Top View

PIN DESCRIPTIONS

ABSOLUTE MAXIMUM RATINGS

Ground Voltage Differences: AGND, DGND ...................................

±0.3V

Power Dissipation .......................................................................... 325mW

Maximum Junction Temperature ................................................... +150

°C

Operating Temperature Range ........................................ –40

°C to +85°C

Storage Temperature Range ......................................... –65

°C to +150°C

Lead Temperature (soldering, 10s) ............................................... +300

°C

ELECTROSTATIC

DISCHARGE SENSITIVITY

This integrated circuit can be damaged by ESD. Burr-Brown

recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and

installation procedures can cause damage.

ESD damage can range from subtle performance degradation to

complete device failure. Precision integrated circuits may be

more susceptible to damage because very small parametric

changes could cause the device not to meet its published specifi-

cations.

REF

IN

REF

OUT

AGND

+V

A

DB11

DB10

DB9

DB8

1

2

3

4

5

6

7

8

24

23

22

21

20

19

18

17

+V

D

DGND

A0

RD

CS

CLOCK

CONVST

BUSY

9

101112131415

16

32

31

30

29

28

ADS7862

27

26

25