3

®

DAC7624/7625

Maximum Junction Temperature ................................................... +150

°C

Operating Temperature Range ........................................ –40

°C to +85°C

Storage Temperature Range ......................................... –65

°C to +150°C

Lead Temperature (soldering, 10s) ............................................... +300

°C

NOTE: (1) Stresses above those listed under “Absolute Maximum Ratings”

may cause permanent damage to the device. Exposure to absolute maximum

conditions for extended periods may affect device reliability.

ELECTROSTATIC

DISCHARGE SENSITIVITY

This integrated circuit can be damaged by ESD. Burr-Brown

recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling

and installation procedures can cause damage.

ESD damage can range from subtle performance degradation

to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric

changes could cause the device not to meet its published

specifications.

PACKAGE/ORDERING INFORMATION

MAXIMUM

MAXIMUM

DIFFERENTIAL

SPECIFICATION

PACKAGE

LINEARITY

LINEARITY

TEMPERATURE

DRAWING

PRODUCT

ERROR (LSB)

ERROR (LSB)

RANGE

PACKAGE

DAC7624P

±2

±1

–40

°C to +85°C

28-Pin Plastic DIP

215

DAC7624U

±2

±1

–40

°C to +85°C

28-Lead SOIC

217

DAC7624PB

±1

±1

–40

°C to +85°C

28-Pin Plastic DIP

215

DAC7624UB

±1

±1

–40

°C to +85°C

28-Lead SOIC

217

DAC7625P

±2

±1

–40

°C to +85°C

28-Pin Plastic DIP

215

DAC7625U

±2

±1

–40

°C to +85°C

28-Lead SOIC

217

DAC7625PB

±1

±1

–40

°C to +85°C

28-Pin Plastic DIP

215

DAC7625UB

±1

±1

–40

°C to +85°C

28-Lead SOIC

217

NOTE: (1) For detailed drawing and dimension table, please see end of data sheet, or Appendix C of Burr-Brown IC Data Book.