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OPA2604AP Datasheet(PDF) 3 Page - Burr-Brown (TI) |
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OPA2604AP Datasheet(HTML) 3 Page - Burr-Brown (TI) |
3 / 12 page 3 OPA2604 ® PIN CONFIGURATION 1 2 3 4 Output A –In A +In A V– 8 7 6 5 V+ Output B –In B +In B Top View DIP/SOIC ABSOLUTE MAXIMUM RATINGS(1) Power Supply Voltage ....................................................................... ±25V Input Voltage ............................................................. (V–)–1V to (V+)+1V Output Short Circuit to Ground ............................................... Continuous Operating Temperature ................................................. –40 °C to +100°C Storage Temperature ..................................................... –40 °C to +125°C Junction Temperature .................................................................... +150 °C Lead Temperature (soldering, 10s) AP ......................................... +300 °C Lead Temperature (soldering, 3s) AU .......................................... +260 °C NOTE: (1) Stresses above these ratings may cause permanent damage. ELECTROSTATIC DISCHARGE SENSITIVITY Any integrated circuit can be damaged by ESD. Burr-Brown recommends that all integrated circuits be handled with ap- propriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet published speci- fications. ORDERING INFORMATION PRODUCT PACKAGE TEMP. RANGE OPA2604AP 8-Pin Plastic DIP –25 °C to +85°C OPA2604AU SO-8 Surface-Mount –25 °C to +85°C PACKAGING INFORMATION PACKAGE DRAWING PRODUCT PACKAGE NUMBER(1) OPA2604AP 8-Pin Plastic DIP 006 OPA2604AU SO-8 Surface-Mount 182 NOTE: (1) For detailed drawing and dimension table, please see end of data sheet, or Appendix C of Burr-Brown IC Data Book. |
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