3

OPA2604

®

PIN CONFIGURATION

1

2

3

4

Output A

–In A

+In A

V–

8

7

6

5

V+

Output B

–In B

+In B

Top View

DIP/SOIC

Power Supply Voltage .......................................................................

±25V

Input Voltage ............................................................. (V–)–1V to (V+)+1V

Output Short Circuit to Ground ............................................... Continuous

Operating Temperature ................................................. –40

°C to +100°C

Storage Temperature ..................................................... –40

°C to +125°C

Junction Temperature .................................................................... +150

°C

Lead Temperature (soldering, 10s) AP ......................................... +300

°C

Lead Temperature (soldering, 3s) AU .......................................... +260

°C

NOTE: (1) Stresses above these ratings may cause permanent damage.

ELECTROSTATIC

DISCHARGE SENSITIVITY

Any integrated circuit can be damaged by ESD. Burr-Brown

recommends that all integrated circuits be handled with ap-

propriate precautions. Failure to observe proper handling and

installation procedures can cause damage.

ESD damage can range from subtle performance degradation

to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric

changes could cause the device not to meet published speci-

fications.

ORDERING INFORMATION

PRODUCT

PACKAGE

TEMP. RANGE

OPA2604AP

8-Pin Plastic DIP

–25

°C to +85°C

OPA2604AU

SO-8 Surface-Mount

–25

°C to +85°C

PACKAGING INFORMATION

PACKAGE DRAWING

PRODUCT

PACKAGE

OPA2604AP

8-Pin Plastic DIP

006

OPA2604AU

SO-8 Surface-Mount

182

NOTE: (1) For detailed drawing and dimension table, please see end of data

sheet, or Appendix C of Burr-Brown IC Data Book.