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SODF157-SH Datasheet(PDF) 5 Page - Leshan Radio Company |
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SODF157-SH Datasheet(HTML) 5 Page - Leshan Radio Company |
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5 / 7 page  Reel packing 5.Suggested thermal profile for soldering process 1. Storage environment：Temperature=5~40℃ Humidity=55±25% 2. Reflow soldering of surface-mount device 3. Reflow soldering SODF151T-SH thru SODF157T-SH SOD123-FL 7" 3,000 4.0 30,000 183*183*123 178 382*262*387 240,000 8.7 PACKAGE REEL SIZE REEL (PCS) COMPONENT SPACING (mm) BOX (pcs) APPOX. GROSS WEIGHT (kg) INNER BOX (mm) REEL DIA. (mm) CARTON SIZE (mm) CARTON (PCS) Time 25℃ to Peak Temperature <6minutes Time maintained above: - Temperature (TL) - Time(tL) Profile Feature Soldering Condition Average ramp-up rate(TL to TP) <3℃/sec Preheat - Temperature Min(Tsmin) - Temperature Max(Tsmax) - Time(min to max)(ts) 150℃ 200℃ 60~120sec Tsmax to TL - Ramp-up Rate <3sec 217℃ 60-260sec Peak Temperature(TP) 255 -0/+5℃ Time within 5℃ of actual Peak Temperature(TP) 10~30sec Ramp-down Rate <6℃/sec |
Similar Part No. - SODF157-SH |
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Similar Description - SODF157-SH |
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