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OPA602SM Datasheet(PDF) 7 Page - Burr-Brown (TI) |
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OPA602SM Datasheet(HTML) 7 Page - Burr-Brown (TI) |
7 / 9 page ® OPA602 7 COMMON-MODE REJECTION vs FREQUENCY 140 1 Frequency (Hz) 10 100 1k 10k 100k 1M 10M 120 100 80 60 40 20 0 POWER SUPPLY REJECTION vs FREQUENCY 140 1 Frequency (Hz) 10 100 1k 10k 100k 1M 10M 120 100 80 60 40 20 0 + – BIAS AND OFFSET CURRENT vs INPUT COMMON MODE VOLTAGE 10 1 0.1 0.01 –15 Common-Mode Voltage (V) 10 1 0.1 0.01 –10 –5 0 5 10 15 Bias Current Offset Current BIAS AND OFFSET CURRENT vs TEMPERATURE 10nA –50 Ambient Temperature (°C) 10nA –25 0 25 50 75 100 125 1nA 100 10 1 0.1 1nA 100 10 1 0.1 TYPICAL PERFORMANCE CURVES (CONT) TA = +25°C, VS = ±15VDC unless otherwise noted. APPLICATIONS INFORMATION Unity-gain stability with good phase margin and excellent output drive characteristics bring freedom from the subtle problems associated with other high speed amplifiers. But with any high speed, wide bandwidth circuitry, careful circuit layout will ensure best performance. Make short, direct interconnections and avoid stray wiring capacitance— especially at the inverting input pin. Power supplies should be bypassed with good high fre- quency capacitors positioned close to the op amp pins. In most cases 0.1 µF ceramic capacitors are adequate. Applica- tions with heavier loads and fast transient waveforms may benefit from use of additional 1.0 µF tantalum bypass capaci- tors. INPUT BIAS CURRENT GUARDING Leakage currents across printed circuit boards can easily exceed the input bias current of the OPA602. A circuit board “guard” pattern (Figure 1) is an effective solution to difficult leakage problems. This guard pattern must be repeated on all layers of a multilayer board. By surrounding critical high impedance input circuitry with a low impedance circuit connection at the same potential, leakage currents will flow harmlessly to the low impedance node. Input bias current may also be degraded by improper han- dling or cleaning. Contamination from handling parts and circuit boards may be cleaned with appropriate solvents and deionized water. Each rinsing operation should be followed by a 30-minute bake at +85 °C. |
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Similar Description - OPA602SM |
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