®

3

PCM1801

PIN CONFIGURATION

The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes no

responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change without notice.

No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant any BURR-BROWN

product for use in life support devices and/or systems.

PIN

NAME

I/O

DESCRIPTION

IN

Analog Input, Lch.

IN

Analog Input, Rch.

3

DGND

—

Digital Ground

—

Digital Power Supply

5

SCKI

IN

6

BCK

IN

Bit Clock Input

7

LRCK

IN

Sampling Clock Input

8

DOUT

OUT

Audio Data Output

9

BYPAS

IN

H: HPF Disabled

10

FMT

IN

11

—

Analog Power Supply

12

AGND

—

Analog Ground

13

—

Reference 2 Decoupling Capacitor

14

—

Reference 1 Decoupling Capacitor

NOTE: (1) With 100k

Ω typical pull-down resistor.

PIN ASSIGNMENTS

Top View

SOIC

Supply Voltage Differences ...............................................................

±0.1V

GND Voltage Differences ..................................................................

±0.1V

Input Current (any pin except supplies) ..........................................

±10mA

Power Dissipation .......................................................................... 300mW

Operating Temperature Range ......................................... –25

°C to +85°C

Storage Temperature ...................................................... –55

°C to +125°C

Lead Temperature (soldering, 5s) .................................................. +260

°C

(reflow, 10s) ..................................................... +235

°C

ABSOLUTE MAXIMUM RATINGS

ELECTROSTATIC

DISCHARGE SENSITIVITY

This integrated circuit can be damaged by ESD. Burr-Brown

recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling

and installation procedures can cause damage.

ESD damage can range from subtle performance degradation

to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric

changes could cause the device not to meet its published

specifications.

PACKAGE

SPECIFIED

DRAWING

TEMPERATURE

PACKAGE

ORDERING

TRANSPORT

PRODUCT

PACKAGE

NUMBER

RANGE

MARKING

MEDIA

PCM1801U

SO-14

235

–25

°C to +85°C

PCM1801U

PCM1801U

Rails

""

"

"

"

PCM1801U/2K

Tape and Reel

NOTE: (1) Models with a slash (/) are available only in Tape and Reel in the quantities indicated (e.g., /2K indicates 2000 devices per reel). Ordering 2000 pieces

of “PCM1801U/2K” will get a single 2000-piece Tape and Reel.

PACKAGE/ORDERING INFORMATION

V

V

DGND

V

DD

SCKI

BCK

LRCK

V

V

AGND

V

CC

FMT

BYPAS

DOUT

1

2

3

4

5

6

7

14

13

12

11

10

9

8

PCM1801U