5

®

PGA204/205

DICE INFORMATION

PAD

FUNCTION

2—

3—

8V–

FPO

MECHANICAL INFORMATION

MILS (0.001")

MILLIMETERS

Die Size

186 x 130

±5

4.72 x 3.30

±0.13

Die Thickness

20

±3

0.51

±0.08

Min. Pad Size

4 x 4

0.1 x 0.1

Backing

Gold

Substrate Bias: Internally connected to V– power supply.

PGA204/205 DIE TOPOGRAPHY

PIN CONFIGURATION

ELECTROSTATIC

DISCHARGE SENSITIVITY

This integrated circuit can be damaged by ESD. Burr-Brown

recommends that all integrated circuits be handled with ap-

propriate precautions. Failure to observe proper handling and

installation procedures can cause damage.

ESD damage can range from subtle performance degradation

to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric

changes could cause the device not to meet its published

specifications.

NC: No Internal Connection.

V

O1

NC

NC

V

–

IN

V

+

IN

V

V

V–

A

1

A

0

Dig. Ground

V+

Feedback

V

O

Ref

V

O2

1

2

3

4

5

6

7

8

16

15

14

13

12

11

10

9

Top View

PAD

FUNCTION

10

Ref

11

12

Feedback

13

V+

14

Dig. Ground

15

16