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ESTW015A0A Datasheet(PDF) 10 Page - Lineage Power Corporation |
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ESTW015A0A Datasheet(HTML) 10 Page - Lineage Power Corporation |
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10 / 19 page  GE Data Sheet ESTW015A0A Barracuda™ Series; DC-DC Converter Power Modules 36-75Vdc Input; 5.0Vdc, 15A, 75W Output March 28, 2013 ©2012 General Electric Company. All rights reserved. Page 10 Figure 18. Cold Wall Mounting COLDPLATE TEMEPERATURE, TC (oC) Figure 19. Derated Output Current versus Cold Wall Temperature with local ambient temperature around module at 85C; VIN =48V. Through-Hole Soldering Information Lead-Free Soldering The ESTW015A0Axx RoHS-compliant through-hole products use SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant components. They are designed to be processed through single or dual wave soldering machines. The pins have a RoHS-compliant finish that is compatible with both Pb and Pb-free wave soldering processes. A maximum preheat rate of 3C/s is suggested. The wave preheat process should be such that the temperature of the power module board is kept below 210C. For Pb solder, the recommended pot temperature is 260C, while the Pb-free solder pot is 270C max. Paste-in-Hole Soldering The ESTW015A0Axx module is compatible with reflow paste- in-hole soldering processes shown in Figures 25-27. Since the ESTW015A0AxxZ module is not packaged per J-STD-033 Rev.A, the module must be baked prior to the paste-in-hole reflow process. ESTW015A0Axx-HZ modules are not compatible with paste-in-hole reflow soldering. Please contact your GE Sales Representative for further information. Surface Mount Information MSL Rating The ESTW015A0A-SZ module has a MSL rating of 2a. Storage and Handling The recommended storage environment and handling procedures for moisture-sensitive surface mount packages is detailed in J-STD-033 Rev. A (Handling, Surface Mount Information (continued) Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices). Moisture barrier bags (MBB) with desiccant are provided for the ESTW015A0Axx-SZ modules. These sealed packages should not be broken until time of use. Once the original package is broken, the floor life of the product at conditions of 30°C and 60% relative humidity varies according to the MSL rating (see J-STD-033A). The shelf life for dry packed SMT packages is a minimum of 12 months from the bag seal date, when stored at the following conditions: < 40° C, < 90% relative humidity . Pick and Place The ESTW015A0A modules use an open frame construction and are designed for a fully automated assembly process. The modules are fitted with a label designed to provide a large surface area for pick and place operations. The label meets all the requirements for surface mount processing, as well as safety standards, and is able to withstand reflow temperatures of up to 300oC. The label also carries product information such as product code, serial number and the location of manufacture. Figure 20. Pick and Place Location. Nozzle Recommendations The module weight has been kept to a minimum by using open frame construction. Even so, these modules have a relatively large mass when compared to conventional SMT components. Variables such as nozzle size, tip style, vacuum pressure and placement speed should be considered to optimize this process. The minimum recommended nozzle diameter for reliable operation is 6mm. The maximum nozzle outer diameter, which will safely fit within the allowable component spacing, is 9 mm. Oblong or oval nozzles up to 11 x 9 mm may also be used within the space available. |
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