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KBVW006A0B641Z Datasheet(PDF) 10 Page - Lineage Power Corporation |
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KBVW006A0B641Z Datasheet(HTML) 10 Page - Lineage Power Corporation |
10 / 20 page GE Data Sheet KBVW006A0B Series Sixteenth-Brick Power Modules 36–75Vdc Input; 12.0Vdc Output; 6A Output Current July 9, 2013 ©2012 General Electric Company. All rights reserved. Page 10 Surface Mount Information Pick and Place The modules use an open frame construction and are designed for a fully automated assembly process. The modules are fitted with a label designed to provide a large surface area for pick and place operations. The label meets all the requirements for surface mount processing, as well as safety standards, and is able to withstand reflow temperatures of up to 300oC. The label also carries product information such as product code, serial number and the location of manufacture. Figure 17. Pick and Place Location. Nozzle Recommendations The module weight has been kept to a minimum by using open frame construction. Even so, these modules have a relatively large mass when compared to conventional SMT components. Variables such as nozzle size, tip style, vacuum pressure and placement speed should be considered to optimize this process. The minimum recommended nozzle diameter for reliable operation is 6mm. The maximum nozzle outer diameter, which will safely fit within the allowable component spacing, is 9 mm. Oblong or oval nozzles up to 11 x 9 mm may also be used within the space available. Tin Lead Soldering The power modules are lead free modules and can be soldered either in a lead-free solder process or in a conventional Tin/Lead (Sn/Pb) process. It is recommended that the customer review data sheets in order to customize the solder reflow profile for each application board assembly. The following instructions must be observed when soldering these units. Failure to observe these instructions may result in the failure of or cause damage to the modules, and can adversely affect long-term reliability. In a conventional Tin/Lead (Sn/Pb) solder process peak reflow temperatures are limited to less than 235oC (see Fig 18). Typically, the eutectic solder melts at 183oC, wets the land, and subsequently wicks the device connection. Sufficient time must be allowed to fuse the plating on the connection to ensure a reliable solder joint. There are several types of SMT reflow technologies currently used in the industry. These surface mount power modules can be reliably soldered using natural forced convection, IR (radiant infrared), or a combination of convection/IR. For reliable soldering the solder reflow profile should be established by accurately measuring the modules CP connector temperatures. REFLOW TIME (S) Figure 18. Reflow Profile for Tin/Lead (Sn/Pb) process Figure 19. Time Limit Curve Above 205oC for Tin/Lead (Sn/Pb) process Lead Free Soldering The –Z version of the modules are lead-free (Pb-free) and RoHS compliant and are both forward and backward compatible in a Pb-free and a SnPb soldering process. Failure to observe the instructions below may result in the failure of or cause damage to the modules and can adversely affect long-term reliability. Pb-free Reflow Profile Power Modules (with the exception of modules that come with heat plate option –H) will comply with J-STD- 020 Rev. C (Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices) for both Pb-free solder profiles and MSL classification procedures. This standard provides a recommended forced-air- convection reflow profile based on the volume and thickness of the package (Table 4-2). The suggested Pb- free solder paste is Sn/Ag/Cu (SAC). The recommended linear reflow profile using Sn/Ag/Cu solder is shown in Figure 21. 0 50 100 150 200 250 300 Preheat zo ne max 4oCs-1 Soak zone 30-240s Heat zo ne max 4oCs-1 Peak Temp 235oC Coo ling zone 1-4oCs-1 T lim above 205oC 200 205 210 215 220 225 230 235 240 0 10 203040 5060 |
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