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KBVW006A0B41SRZ Datasheet(PDF) 11 Page - Lineage Power Corporation |
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KBVW006A0B41SRZ Datasheet(HTML) 11 Page - Lineage Power Corporation |
11 / 20 page GE Data Sheet KBVW006A0B Series Sixteenth-Brick Power Modules 36–75Vdc Input; 12.0Vdc Output; 6A Output Current July 9, 2013 ©2012 General Electric Company. All rights reserved. Page 11 Figure 20. Recommended linear reflow profile using Sn/Ag/Cu solder. Through-Hole Lead-Free Soldering Information The RoHS-compliant, Z option, through-hole products use the SAC (Sn/Ag/Cu) Pb-free solder and RoHS- compliant components. They are designed to be processed through single or dual wave soldering machines. The pins have a RoHS-compliant, pure tin finish that is compatible with both Pb and Pb-free wave soldering processes. A maximum preheat rate of 3C/s is suggested. The wave preheat process should be such that the temperature of the power module board is kept below 210C. For Pb solder, the recommended pot temperature is 260C, while the Pb-free solder pot is 270C max. Reflow Lead-Free Soldering Information The RoHS-compliant through-hole products (with the exception of modules that come with heat plate option – H) can be processed with the following paste-through- hole Pb or Pb-free reflow process. Max. sustain temperature: 245C (J-STD-020C Table 4-2: Packaging Thickness>=2.5mm / Volume > 2000mm3), Peak temperature over 245C is not suggested due to the potential reliability risk of components under continuous high-temperature. Min. sustain duration above 217C: 90 seconds Min. sustain duration above 180C: 150 seconds Max. heat up rate: 3C/sec Max. cool down rate: 4C/sec In compliance with JEDEC J-STD-020C spec for 2 times reflow requirement. Pb-free Reflow Profile BMP module (with the exception of modules that come with heat plate option –H) will comply with J-STD-020 Rev. C (Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices) for both Pb-free solder profiles and MSL classification procedures. BMP will comply with JEDEC J-STD-020C specification for 3 times reflow requirement. The suggested Pb-free solder paste is Sn/Ag/Cu (SAC). The recommended linear reflow profile using Sn/Ag/Cu solder is shown in Figure 21. Time Ramp up max. 3°C/Sec Ramp down max. 4°C/Sec Time Limited 90 Sec. above 217°C Preheat time 100-150 Sec. Peak Temp. 240 -245°C 25°C 150°C 200°C 217°C Figure 21. Recommended linear reflow profile using Sn/Ag/Cu solder. MSL Rating The modules have a MSL rating of 2a. Storage and Handling The recommended storage environment and handling procedures for moisture-sensitive surface mount packages is detailed in J-STD-033 Rev. A (Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices). Moisture Barrier Bags (MBB) with desiccant are required for MSL ratings of 2 or greater. These sealed packages should not be broken until time of use. Once the original package is broken, the floor life of the product at conditions of 30°C and 60% relative humidity varies according to the MSL rating (see J-STD-033A). The shelf life for dry packed SMT packages will be a minimum of 12 months from the bag seal date, when stored at the following conditions: < 40° C, < 90% relative humidity. Post Solder Cleaning and Drying Considerations Post solder cleaning is usually the final circuit-board assembly process prior to electrical board testing. The result of inadequate cleaning and drying can affect both the reliability of a power module and the testability of the finished circuit-board assembly. For guidance on appropriate soldering, cleaning and drying procedures, refer to Lineage Power Board Mounted Power Modules: Soldering and Cleaning Application Note (AN04-001) |
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