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QBVE078A0S10R441HZ Datasheet(PDF) 9 Page - Lineage Power Corporation |
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QBVE078A0S10R441HZ Datasheet(HTML) 9 Page - Lineage Power Corporation |
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9 / 17 page  GE Data Sheet QBVE078A0S10R4 Barracuda Series; DC-DC Converter Power Modules 45-56Vdc Input; 10.4Vdc, 78.0A, 810W Output January 15, 2014 ©2012 General Electric Company. All rights reserved. Page 9 Feature Descriptions (continued) Thermal Considerations The power modules operate in a variety of thermal environments and sufficient cooling should be provided to help ensure reliable operation. Thermal considerations include ambient temperature, airflow, module power dissipation, and the need for increased reliability. A reduction in the operating temperature of the module will result in an increase in reliability. The thermal data presented here is based on physical measurements taken in a wind tunnel. Heat-dissipating components are mounted on the top side of the module. Heat is removed by conduction, convection and radiation to the surrounding environment. Proper cooling can be verified by measuring the thermal reference temperature (TH2). Figure 16. Location of the thermal reference temperature TH2 for base plate module. Peak temperature occurs at the position indicated in Figure 16. For reliable operation this temperature should not exceed TH2=115°C. For extremely high reliability you can limit this temperature to a lower value. The output power of the module should not exceed the rated power for the module as listed in the Ordering Information table. Heat Transfer via Convection The thermal data presented here is based on physical measurements taken in a wind tunnel, using automated thermo-couple instrumentation to monitor key component temperatures: FETs, diodes, control ICs, magnetic cores, ceramic capacitors, opto-isolators, and module pwb conductors, while controlling the ambient airflow rate and temperature. For a given airflow and ambient temperature, the module output power is increased, until one (or more) of the components reaches its maximum derated operating temperature, as defined in IPC-9592B. This procedure is then repeated for a different airflow or ambient temperature until a family of module output derating curves is obtained. Please refer to the Application Note “Thermal Characterization Process For Open-Frame Board-Mounted Power Modules” for a detailed discussion of thermal aspects including maximum device temperatures. Figure 17. Thermal Test Setup . Increased airflow over the module enhances the heat transfer via convection. The thermal derating of figure 18- 25 shows the maximum output current that can be delivered by each module in the indicated orientation without exceeding the maximum THx temperature versus local ambient temperature (TA) for several air flow conditions. |
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