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SSTW005A0F Datasheet(PDF) 9 Page - Lineage Power Corporation |
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SSTW005A0F Datasheet(HTML) 9 Page - Lineage Power Corporation |
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9 / 15 page  G S 3 a 3 C P P d d E F c F F F p L T u c m c m p F s GE SSTW00 36-75Vdc In March 26, 2013 ambient tempe 3m/s (600 ft./m Curves section. Please refer to t Process For Op detailed discuss device tempera EMC Requir Figure 16 show conducted emis Figure 16. Sugg Ref C1 , C C4, L L Figure 17. EMC For further info please refer to t Layout Con The SSTW powe used in fine pitc component clea module and the copper areas o module. Also a power module. For additional la sheet. 5A0F Ba nput; 3.3Vd erature (TA) for n min) are shown the Application en-Frame Boa sion of therma atures. rements ws a maximum ssion limits of E gested Configu Des C2, C3 C5 1 2 C signature usi rmation on des the FLTR100V1 nsideration er module serie ch system card arance betwee e mounting bo n the outer lay void placing vi ayout guide-lin rracuda dc, 5A, 15W © natural convec in the respectiv n Note “Therma rd-Mounted Po al aspects inclu filter configura EN55022 Class uration for EN 2 3 4m 10 ing above filte signing for EMC 10 data sheet ( ns es are low prof d architectures en the bottom ard is limited. A yer directly und a interconnect nes, refer to the ™ Series W Output ©2012 General E ction and up to ve Characteris al Characteriza ower Modules” ding maximum ation to meet th s B. 55022 Class B Filter .2uF/100V 33nF Y cap mH CM choke uH inductor er, SSTWA. C compliance, FDS01-043EPS file in order to b s. As such, of the power Avoid placing derneath the po ts underneath e FLTR100V10 s; DC-DC lectric Company o tics ation ” for a m he B. S). be ower the data The S Thro Thr The SAC com singl RoHS free 3C/ that 210 260 Hole solde proc cons Sur Pick The S open asse The S mag Note Figu Z Pla The ‘ nom Noz The fram whe Varia plac proc The oper will s 6.5m C Convert y. All rights reserv SSTW family of ough-Hole (TH) ough-Hole S RoHS-complia (Sn/Ag/Cu) Pb- ponents. They le or dual wave S-compliant fin wave soldering /s is suggested the temperatu C. For Pb sold C, while the Pb e module is also ering. Refer to cess details. If a sult with your G rface Moun k and Place SSTW-SR serie n-frame constr embly within a SSTW-SR serie gnetic compone e: All dimension re 18. Pick and ane Height ‘Z’ plane heigh minal with an RS zzle Recomme module weight me construction n compared w ables such as n ement speed s cess. minimum reco ration is 5mm. safely fit within mm. ter Powe ved. f power modul or Surface Mo Soldering In nt (Z codes) thr -free solder an y are designed e soldering ma nish that is com g processes. A . The wave pre ure of the powe er, the recomm b-free solder po o compatible w the Reflow Sol additional info GE representat nt Informat s of DC-to-DC ruction and are fully automate s modules are ent surface to ns in mm [in]. d Place Locatio t of the pick an SS tolerance of endations t has been kep n. Even so, they with convention nozzle size, tip should be cons ommended noz The maximum n the allowable Data Sh er Modu es is available unt (SMT) solde nformation rough-hole pro d RoHS-compl to be processe achines. The pi mpatible with b maximum pre eheat process er module boa mended pot tem ot is 270C ma with paste-in-h dering Informa rmation is nee ive for more de tion power convert e designed for ed manufacturi designed to us allow for pick a on. nd place locatio f +/-0.25 mm. pt to a minimum y have a relativ nal SMT compo style, vacuum sidered to optim zzle diameter fo m nozzle outer d component sp heet les Page for either ering. oducts use the iant ed through ns have an both Pb and Pb eheat rate of should be such rd is kept below mperature is ax. The Throug ole reflow ation section fo ded, please etails. ters use an surface mount ing process. se the main and place. on is 7.50mm m by using ope vely large mas nents. pressure and mize this or reliable diameter, whic pacing, is e 9 b- h w h or t en ss h |
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