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CMPWR101 Datasheet(PDF) 6 Page - California Micro Devices Corp

Part # CMPWR101
Description  250mA SMARTOR Regulator with V switch
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Manufacturer  CALMIRCO [California Micro Devices Corp]
Direct Link  http://www.calmicro.com
Logo CALMIRCO - California Micro Devices Corp

CMPWR101 Datasheet(HTML) 6 Page - California Micro Devices Corp

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CALIFORNIA MICRO DEVICES
©2001 California Micro Devices Corp. All rights reserved. SmartOR™ is a trademark of California Micro Devices Corporation.
3/6/2001
215 Topaz Street, Milpitas, California 95035

Tel: (408) 263-3214
Fax: (408) 263-7846
www.calmicro.com
6
CMPWR101
Typical Thermal Characteristics
The overall junction to ambient thermal resistance (
θ
JA)
for device power dissipation (P
D) consists primarily of
two paths in series. The first path is the junction to the
case (
θ
JC) which is defined by the package style, and the
second path is case to ambient (
θ
CA) thermal resistance
which is dependent on board layout. The final operating
junction temperature for any set of conditions can be
estimated by the following thermal equation:
T
JUNC = TAMB + PD JC ) + PD CA )
= T
AMB + PD JA)
The CMPWR101 uses a standard SOIC package. When
this package is mounted on a double sided printed
circuit board with two square inches of copper allocated
for “heat spreading”, the resulting overall
θ
JA is 85°C/W.
Based on maximum power dissipation of 0.43W
(1.7V x 250mA) with an ambient of 70°C the resulting
junction temperature will be:
T
JUNC = TAMB + PD JA )
= 70°C + 0.43W (80°C/W)
= 70°C + 37°C
= 103°C
Thermal characteristics were measured using a double
sided board with two square inches of copper area
connected to the GND pins for “heat spreading”.
Measurements showing performance up to junction
temperature of 125°C were performed under light load
conditions (5mA). This allows the ambient temperature
to be representative of the internal junction temperature.
Note: The use of multi-layer board construction with
power planes will further enhance the thermal perfor-
mance of the package. In the event of no copper area
being dedicated for heat spreading, a multi-layer board
construction, using only the minimum size pad layout,
will typically provide the CMPWR101 with an overall
θ
JA
of 100°C/W, which allows up to 0.5W to be safely
dissipated.
3.284
3.286
3.288
3.290
3.292
3.294
3.296
3.298
3.300
20
30
40
50
60
70
Ambient Temperature (˚C)
Figure 13. Regulator V
OUT vs TAMB (250mA Load)
4.08
4.10
4.12
4.14
4.16
4.18
25
50
75
100
125
Junction Temperature (˚C)
Figure 14. Deselect Threshold vs T
JUNCT
0.20
0,22
0.24
0.26
0.28
0.30
0.32
0.34
0.36
20
30
40
50
60
70
Ambient Temperature (
˚C)
Figure 15. Switch Resistance vs AmbientTemperature


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