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SPX2815AR-5-0TR Datasheet(PDF) 3 Page - Sipex Corporation |
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SPX2815AR-5-0TR Datasheet(HTML) 3 Page - Sipex Corporation |
3 / 10 page 3 Date: 6/21/06 Rev C SPX2815 1.5A Low Dropout Voltage Regulator © 2006 Sipex Corporation TYPICAL PERFORMANCE CHARACTERISTICS Figure 1. Line Regulation for SPX2815U-3.3; I OUT=10mA 3.300 3.305 3.310 3.315 3.320 3.325 4.5 6.5 8.5 10.5 12.5 14.5 Vin (V) 1.225 1.23 1.235 1.24 1.245 1.25 1.255 1.26 1.265 1.27 1.275 -50 -30 -10 10 30 50 70 90 110 130 Temp (C) 1.25v Adj Figure 2. V OUT vs Temperature, VIN=2.5V, IOUT=10mA Figure 3. V IN=4.0V, IOUT=10mA 2.45 2.46 2.47 2.48 2.49 2.5 2.51 2.52 2.53 2.54 2.55 -50 -30 -10 10 30 50 70 90 110 130 Temp (C) 2.5v Adj 2.5v Fixed Figure 4. V IN=5.0V, IOUT=10mA 3.26 3.28 3.3 3.32 3.34 3.36 3.38 -50 -30 -10 10 30 50 70 90 110 130 Temp (C) 3.3v Adj 3.3v Fixed Output Capacitor To ensure the stability of the SPX2815, an output capacitor of at least 10 μF (ceramic or tantalum) or 22 μF (aluminum) is required. The value may change based on the application requirements of the output load or temperature range. The value of Equivalent Series Resis- tance (ESR) can vary based on the type of capacitor used in the applications to guarantee stability. The recommended value for ESR is 0.5 Ω or less. A larger value of output capaci- tance (up to 100 μF) can improve the load tran- sient response. Soldering Methods The SPX2815 die is attached to the heatsink lead which exits opposite the input, output, and ground pins. Thermal Characteristics The SPX2815 features internal thermal limiting to protect the device during overload condi- tions. Special care needs to be taken during continuous load conditions such that the maxi- mum junction temperature does not exceed 125 °C. Thermal protection is activated at >179°C and deactiviated at <165 °C. The thermal interaction from other components in the application can affect the thermal resis- tance of the SPX2815. The actual thermal resistance can be determined with experimenta- tion. SPX2815 power dissipation is calculated as follows: P D = (VIN - VOUT)(IOUT) Maximum Junction Temperature range: T J = TA(max) + PD* θJA (thermal resistance, junction-to-ambient) Maximum junction temperature must not ex- ceed 125 °C. APPLICATION INFORMATION |
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