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LTST-C155GYKT Datasheet(PDF) 10 Page - Lite-On Technology Corporation |
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LTST-C155GYKT Datasheet(HTML) 10 Page - Lite-On Technology Corporation |
10 / 10 page LITE-ON TECHNOLOGY CORPORATION P r o p e r t y o f L i t e - O n O n l y Part No. : LTST-C155GYKT Page : 10 of 10 BNS-OD-C131/A4 ESD-damaged LEDs will exhibit abnormal characteristics such as high reverse leakage current, low forward voltage, or “ no lightup ” at low currents. To verify for ESD damage, check for “ lightup ” and Vf of the suspect LEDs at low currents. The Vf of “ good ” LEDs should be >2.0V@0.1mA for InGaN product and >1.4V@0.1mA for AlInGaP product. 7. Reliability Test Classification Test Item Test Condition Reference Standard Operation Life Ta= Under Room Temperature As Per Data Sheet Maximum Rating *Test Time= 1000HRS (-24HRS,+72HRS)*@20mA. MIL-STD-750D:1026 (1995) MIL-STD-883D:1005 (1991) JIS C 7021:B-1 (1982) High Temperature High Humidity Storage IR-Reflow In-Board, 2 Times Ta= 65±5℃,RH= 90~95% *Test Time= 240HRS±2HRS MIL-STD-202F:103B(1980) JIS C 7021:B-11(1982) High Temperature Storage Ta= 105±5℃ *Test Time= 1000HRS (-24HRS,+72HRS) MIL-STD-883D:1008 (1991) JIS C 7021:B-10 (1982) Endurance Test Low Temperature Storage Ta= -55±5℃ *Test Time=1000HRS (-24HRS,+72H RS) JIS C 7021:B-12 (1982) Temperature Cycling 105℃ ~ 25℃ ~ -55℃ ~ 25℃ 30mins 5mins 30mins 5mins 10 Cycles MIL-STD-202F:107D (1980) MIL-STD-750D:1051(1995) MIL-STD-883D:1010 (1991) JIS C 7021:A-4(1982) Thermal Shock IR-Reflow In-Board, 2 Times 85 ± 5℃ ~ -40℃ ± 5℃ 10mins 10mins 10 Cycles MIL-STD-202F:107D(1980) MIL-STD-750D:1051(1995) MIL-STD-883D:1011 (1991) Solder Resistance T.sol= 260 ± 5℃ Dwell Time= 10 ± 1secs MIL-STD-202F:210A(1980) MIL-STD-750D:2031(1995) JIS C 7021:A-1(1982) IR-Reflow Normal Process Ramp-up rate(183℃ to Peak) +3℃/ second max Temp. maintain at 125(±25)℃ 120 seconds max Temp. maintain above 183℃ 60-150 seconds Peak temperature range 235℃+5/-0℃ Time within 5°C of actual Peak Temperature (tp) 10-30 seconds Ramp-down rate +6℃/second max MIL-STD-750D:2031.2(1995) J-STD-020(1999) IR-Reflow Pb Free Process Ramp-up rate(217 to Peak) +3 / second max ℃ ℃ Temp. maintain at 175(±25) 180 seconds max ℃ Temp. maintain above 217 60 ℃ -150 seconds Peak temperature range 260 +0/ ℃ -5℃ Time within 5°C of actual Peak Temperature (tp) 20-40 seconds Ramp-down rate +6 /second max ℃ MIL-STD-750D:2031.2(1995) J-STD-020(1999) Environmental Test Solderability T.sol= 235 ± 5℃ Immersion time 2±0.5 sec Immersion rate 25±2.5 mm/sec Coverage ≧95% of the dipped surface MIL-STD-202F:208D(1980) MIL-STD-750D:2026(1995) MIL-STD-883D:2003(1991) IEC 68 Part 2-20 JIS C 7021:A-2(1982) 8. Others The appearance and specifications of the product may be modified for improvement without prior notice. |
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