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LTST-C155GYKT Datasheet(PDF) 10 Page - Lite-On Technology Corporation

Part # LTST-C155GYKT
Description  ROHS/ Package In 8mm Tape On 7" Diameter Reels
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Manufacturer  LITEON [Lite-On Technology Corporation]
Direct Link  http://www.liteon.com.tw/databook/default.htm
Logo LITEON - Lite-On Technology Corporation

LTST-C155GYKT Datasheet(HTML) 10 Page - Lite-On Technology Corporation

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LITE-ON
TECHNOLOGY
CORPORATION
P r o p e r t y o f L i t e - O n O n l y
Part
No. : LTST-C155GYKT
Page :
10
of
10
BNS-OD-C131/A4
ESD-damaged LEDs will exhibit abnormal characteristics such as high reverse leakage current, low forward
voltage, or “ no lightup ” at low currents.
To verify for ESD damage, check for “ lightup ” and Vf of the suspect LEDs at low currents.
The Vf of “ good ” LEDs should be >2.0V@0.1mA for InGaN product and >1.4V@0.1mA for AlInGaP product.
7. Reliability Test
Classification
Test Item
Test Condition
Reference Standard
Operation Life
Ta= Under Room Temperature As Per Data Sheet
Maximum Rating
*Test Time= 1000HRS (-24HRS,+72HRS)*@20mA.
MIL-STD-750D:1026 (1995)
MIL-STD-883D:1005 (1991)
JIS C 7021:B-1 (1982)
High Temperature
High Humidity
Storage
IR-Reflow In-Board, 2 Times
Ta= 65±5℃,RH= 90~95%
*Test Time= 240HRS±2HRS
MIL-STD-202F:103B(1980)
JIS C 7021:B-11(1982)
High Temperature
Storage
Ta= 105±5℃
*Test Time= 1000HRS (-24HRS,+72HRS)
MIL-STD-883D:1008 (1991)
JIS C 7021:B-10 (1982)
Endurance
Test
Low Temperature
Storage
Ta= -55±5℃
*Test Time=1000HRS (-24HRS,+72H RS)
JIS C 7021:B-12 (1982)
Temperature
Cycling
105℃ ~ 25℃ ~ -55℃ ~ 25℃
30mins
5mins
30mins
5mins
10 Cycles
MIL-STD-202F:107D (1980)
MIL-STD-750D:1051(1995)
MIL-STD-883D:1010 (1991)
JIS C 7021:A-4(1982)
Thermal
Shock
IR-Reflow In-Board, 2 Times
85 ± 5℃ ~ -40℃ ± 5℃
10mins
10mins
10 Cycles
MIL-STD-202F:107D(1980)
MIL-STD-750D:1051(1995)
MIL-STD-883D:1011 (1991)
Solder
Resistance
T.sol= 260 ± 5℃
Dwell Time= 10 ± 1secs
MIL-STD-202F:210A(1980)
MIL-STD-750D:2031(1995)
JIS C 7021:A-1(1982)
IR-Reflow
Normal Process
Ramp-up rate(183℃ to Peak) +3℃/ second max
Temp. maintain at 125(±25)℃ 120 seconds max
Temp. maintain above 183℃ 60-150 seconds
Peak temperature range 235℃+5/-0℃
Time within 5°C of actual Peak Temperature (tp)
10-30 seconds
Ramp-down rate +6℃/second max
MIL-STD-750D:2031.2(1995)
J-STD-020(1999)
IR-Reflow
Pb Free Process
Ramp-up rate(217
to Peak) +3
/ second max
Temp. maintain at 175(±25)
180 seconds max
Temp. maintain above 217
60
-150 seconds
Peak temperature range 260
+0/
-5℃
Time within 5°C of actual Peak Temperature (tp)
20-40 seconds
Ramp-down rate +6
/second max
MIL-STD-750D:2031.2(1995)
J-STD-020(1999)
Environmental
Test
Solderability
T.sol= 235 ± 5℃
Immersion time 2±0.5 sec
Immersion rate 25±2.5 mm/sec
Coverage ≧95% of the dipped surface
MIL-STD-202F:208D(1980)
MIL-STD-750D:2026(1995)
MIL-STD-883D:2003(1991)
IEC 68 Part 2-20
JIS C 7021:A-2(1982)
8. Others
The appearance and specifications of the product may be modified for improvement without prior notice.


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