6

www.johanson dielectrics.com

0402 (X07)

0603 (X14)

0805 (X15)

1206 (X18)

1210 (X41)

1410 (X44)

1812 (X43)

IN

mm

IN

mm

IN

mm

IN

mm

IN

mm

IN

mm

IN

mm

X

0.020

0.51

0.035

0.89

0.050

1.27

0.065

1.65

0.100

2.54

0.100

2.54

0.125

3.18

Y

0.020

0.51

0.025

0.64

0.035

0.89

0.040

1.02

0.040

1.02

0.040

1.02

0.040

1.02

G

0.024

0.61

0.040

1.02

0.050

1.27

0.080

2.03

0.080

2.03

0.100

2.54

0.130

3.30

V

0.015

0.38

0.020

0.51

0.022

0.56

0.040

1.02

0.045

1.14

0.045

1.14

0.045

1.14

U

0.039

0.99

0.060

1.52

0.080

2.03

0.120

3.05

0.160

4.06

0.160

4.06

0.190

4.83

Z

0.064

1.63

0.090

2.29

0.120

3.05

0.160

4.06

0.160

4.06

0.180

4.57

0.210

5.33

Use of solder mask beneath component is not recommended because of flux/contaminant entrapment.

V

V

V

Z

X

U

V

G

Y

Recommended X2Y

Bypass Layout

X2Y capacitors deliver excellent performance in EMI/RFI filtering and Power Bypass applications. Physical and electrical placement

on the PCB is critical in achieving good results. A low inductance, dual ground connection is mandatory.

Fig. 1

Fig. 2

Fig. 3

Fig. 4

Fig. 5

recommended layout against a poor layout. Because of its long extents from

device terminals to vias, and the wide via separation, the poor layout exhibits

approximately 200% L1 inductance, and 150% L2 inductance compared to

Mounting.

Ceramic capacitors (X2Y and standard MLC types) can be easily damaged when hand soldered. Thermal cracking of the ceramic

body is often invisible even under a microscope. Factors that increase thermal cracking risk:

1. 4 terminals to solder can increase hand-soldering time and temperature exposure

2. Pb-free solders have higher reflow temperatures

3. Low inductance connections to ground are inherently good heat-sinks

A damaged component may exhibit a short circuit immediately and not recover, or may operate with intermittent Insulation Resistance

(IR) levels. If you are not achieving expected results and have followed the other guidelines carefully, check to see you are adhering to

the soldering guidelines below:

• Always pre-heat the PCB and component to within 50°C of solder reflow temperature at 2°C/sec. maximum.

• Use contact-less hand solder tools such as a hot air pencil, IR lamp, etc.

• Avoid over-heating of the ceramic component, temperature limit: 260°C for 20-30 seconds max.

• Use a soldering iron as last resort; 20W max. tip, NO CONTACT with ceramic, limit solder time to 5 seconds max.

A reliable, cost effective prototype PCB reflow soldering process is possible using a household toaster oven. There are several good

procedures available on-line by googling “Toaster Oven Soldering”