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AUIRFR1018ETR Datasheet(PDF) 1 Page - International Rectifier

Part # AUIRFR1018ETR
Description  Advanced Process Technology Ultra Low On-Resistance
Download  12 Pages
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Manufacturer  IRF [International Rectifier]
Direct Link  http://www.irf.com
Logo IRF - International Rectifier

AUIRFR1018ETR Datasheet(HTML) 1 Page - International Rectifier

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06/17/11
www.irf.com
1
HEXFET® Power MOSFET
PD - 97685
AUIRFR1018E
S
D
G
VDSS
60V
RDS(on) typ.
7.1m:
max.
8.4m:
ID (Silicon Limited)
79A c
ID (Package Limited)
56A
AUTOMOTIVE GRADE
Description
Specifically designed for Automotive applications, this HEXFET®
Power MOSFET utilizes the latest processing techniques to achieve
extremely low on-resistance per silicon area. Additional features of
this design are a 175°C junction operating temperature, fast switching
speed and improved repetitive avalanche rating . These features
combine to make this design an extremely efficient and reliable
device for use in Automotive applications and a wide variety of other
applications.
Features
Advanced Process Technology
Ultra Low On-Resistance
175°C Operating Temperature
Fast Switching
Repetitive Avalanche Allowed up to Tjmax
Lead-Free, RoHS Compliant
Automotive Qualified *
Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only; and
functional operation of the device at these or any other condition beyond those indicated in the specifications is not implied. Exposure to absolute-
maximum-rated conditions for extended periods may affect device reliability. The thermal resistance and power dissipation ratings are measured under
board mounted and still air conditions. Ambient temperature (TA) is 25°C, unless otherwise specified.
GD
S
Gate
Drain
Source
D-Pak
AUIRFR1018E
G
S
D
HEXFET® is a registered trademark of International Rectifier.
*Qualification standards can be found at http://www.irf.com/
Symbol
Parameter
Units
ID @ TC = 25°C
Continuous Drain Current, VGS @ 10V (Silicon Limited)
ID @ TC = 100°C
Continuous Drain Current, VGS @ 10V (Silicon Limited)
ID @ TC = 25°C
Continuous Drain Current, VGS @ 10V (Wire Bond Limited)
A
IDM
Pulsed Drain Current
d
PD @TC = 25°C
Maximum Power Dissipation
W
Linear Derating Factor
W/°C
VGS
Gate-to-Source Voltage
V
EAS
Single Pulse Avalanche Energy (Thermally limited) e
mJ
IAR
Avalanche Current d
A
EAR
Repetitive Avalanche Energy e
mJ
dv/dt
Peak Diode Recovery
f
V/ns
TJ
Operating Junction and
°C
TSTG
Storage Temperature Range
Soldering Temperature, for 10 seconds
(1.6mm from case)
Thermal Resistance
Symbol
Parameter
Typ.
Max.
Units
RθJC
Junction-to-Case
k
–––
1.32
RθJA
Junction-to-Ambient (PCB Mount)
j
–––
50
RθJA
Junction-to-Ambient
–––
110
11
56
c
110
21
-55 to + 175
± 20
0.76
88
47
°C/W
300
Max.
79
c
56
315


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