LM2758

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SNVS551D – APRIL 2008 – REVISED MAY 2013

Absolute Maximum Ratings

(1) (2) (3)

-0.3V to 6.0V

EN1, EN2 pins: Voltage to GND

w/ 6.0V max

Continuous Power Dissipation

(4)

Internally Limited

150°C

Storage Temperature Range

-65°C to 150°C

Maximum Lead Temp. (Soldering)

(5)

Human Body Model

2kV

Machine Model

200V

(1)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(2)

Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under

which operation of the device is ensured. Operating Ratings do not imply ensured performance limits. For ensured performance limits

and associated test conditions, see the Electrical Characteristics tables.

(3)

All voltages are with respect to the potential to the GND pin.

(4)

(5)

For detailed soldering specifications and information, please refer to Texas Instruments Application Note AN-1112 (SNVA009).

(6)

The Human body model is a 100 pF capacitor discharged through a 1.5 k

Ω resistor into each pin. The machine model is a 200pF

capacitor discharged directly into each pin. MIL-STD-883 3015.7

Operating Ratings

(1) (2)

Input Voltage Range

2.7V to 5.5V

-40°C to +125°C

(3)

-40°C to +85 °C

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under

which operation of the device is ensured. Operating Ratings do not imply ensured performance limits. For ensured performance limits

and associated test conditions, see the Electrical Characteristics tables.

(2)

All voltages are with respect to the potential to the GND pin.

(3)

In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

part/package in the application (

Thermal Information

Junction-to-Ambient Thermal Resistance

Resistance (

(1)

56°C/W

(1)

Junction-to-ambient thermal resistance (

forth in the JEDEC standard JESD51-7. The test board is a 4-layer FR-4 board measuring 102 mm x 76 mm x 1.6 mm with a 2x1 array

of thermal vias. The ground plane on the board is 50 mm x 50 mm. Thickness of copper layers are 53µm/35µm/35µm/53µm

(1.5oz/1oz/1oz/1.5oz). Ambient temperature in simulation is 22°C, still air. Power dissipation is 1W.The value of

DSBGA could fall in a range as wide as 50ºC/W to 150ºC/W (if not wider), depending on PWB material, layout, and environmental

dissipation issues.

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