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AUIRFR9024N Datasheet(PDF) 2 Page - International Rectifier

Part # AUIRFR9024N
Description  HEXFET짰 Power MOSFET
Download  13 Pages
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Manufacturer  IRF [International Rectifier]
Direct Link  http://www.irf.com
Logo IRF - International Rectifier

AUIRFR9024N Datasheet(HTML) 2 Page - International Rectifier

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AUIRFR/U9024N
2
www.irf.com
Repetitive rating; pulse width limited by
max. junction temperature. (See fig. 11).
‚Starting TJ = 25°C, L = 2.8mH
RG = 25Ω, IAS = -6.6A (See Figure 12)
ƒISD ≤ -6.6A, di/dt ≤ -240A/µs, VDD ≤ V(BR)DSS,
TJ ≤ 150°C
Notes:
S
D
G
S
D
G
Static Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
Parameter
Min.
Typ.
Max. Units
V(BR)DSS
Drain-to-Source Breakdown Voltage
-55
–––
–––
V
∆V(BR)DSS/∆TJ
Breakdown Voltage Temp. Coefficient
–––
-0.05
–––
V/°C
RDS(on)
Static Drain-to-Source On-Resistance
–––
–––
0.175
VGS(th)
Gate Threshold Voltage
-2.0
–––
-4.0
V
gfs
Forward Transconductance
2.5
–––
–––
S
IDSS
Drain-to-Source Leakage Current
–––
–––
-25
µA
–––
–––
-250
IGSS
Gate-to-Source Forward Leakage
–––
–––
100
nA
Gate-to-Source Reverse Leakage
–––
–––
-100
Dynamic Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
Qg
Total Gate Charge
–––
–––
19
Qgs
Gate-to-Source Charge
–––
–––
5.1
nC
Qgd
Gate-to-Drain ("Miller") Charge
–––
–––
10
td(on)
Turn-On Delay Time
–––
13
–––
tr
Rise Time
–––
55
–––
td(off)
Turn-Off Delay Time
–––
23
–––
ns
tf
Fall Time
–––
37
–––
LD
Internal Drain Inductance
Between lead,
nH
6mm (0.25in.)
LS
Internal Source Inductance
from package
and center of die contact
Ciss
Input Capacitance
–––
350
–––
Coss
Output Capacitance
–––
170
–––
Crss
Reverse Transfer Capacitance
–––
92
–––
Diode Characteristics
Parameter
Min.
Typ.
Max. Units
IS
Continuous Source Current
(Body Diode)
A
ISM
Pulsed Source Current
(Body Diode)
Ù
VSD
Diode Forward Voltage
–––
–––
-1.6
V
trr
Reverse Recovery Time
–––
47
71
ns
Qrr
Reverse Recovery Charge
–––
84
130
nC
ton
Forward Turn-On Time
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)
pF
–––
–––
–––
–––
-11
-44
–––
–––
–––
–––
4.5
7.5
VGS = -10V,See Fig 6 and 13 fh
VDD = -28V
ID = -7.2A
RG = 24
TJ = 25°C, IS = -7.2A, VGS = 0V f
TJ = 25°C, IF = -7.2A
di/dt = 100A/µs
fh
Conditions
VGS = 0V, ID = -250µA
Reference to 25°C, ID = -1mA
VGS = -10V, ID = -6.6A
f
VDS = VGS, ID = -250µA
VDS = -55V, VGS = 0V
VDS = -44V, VGS = 0V, TJ = 150°C
MOSFET symbol
showing the
integral reverse
p-n junction diode.
VDS = -25V, ID = -7.2A
h
ID = -7.2A
VDS = -44V
Conditions
RD = 3.7
Ω, See Fig.10
Ãfh
VGS = 0V
VDS = -25V
ƒ = 1.0MHz,see Fig.5
h
VGS = -20V
VGS = 20V
„Pulse width ≤ 300µs; duty cycle ≤ 2%.
… This is applied for I-PAK, LS of D-PAK is measured between
lead and center of die contact.
† Uses IRF9Z24N data and test conditions.
** When mounted on 1" square PCB (FR-4 or G-10 Material).
For recommended footprint and soldering techniques refer to application note #AN-994.


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