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T530X477M006A Datasheet(PDF) 9 Page - Kemet Corporation |
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T530X477M006A Datasheet(HTML) 9 Page - Kemet Corporation |
9 / 17 page © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com T2019_T530 • 2/3/2014 99 KEMET Organic Capacitor (KO-CAP) – T530 High Capacitance/125°C Rated Polymer Tantalum Time Tsmin 25ºC to Peak tL tS 25 tP Tsmax TL TP Maximum Ramp Up Rate = 3ºC/seconds Maximum Ramp Down Rate = 6ºC/seconds Soldering Process KEMET’s families of surface mount capacitors are compatible withwave(singleordual),convection,IR,orvaporphasereflow techniques. Preheating of these components is recommended toavoidextremethermalstress.KEMET'srecommended profileconditionsforconvectionandIRreflowreflecttheprofile conditions of the IPC/J–STD–020D standard for moisture sensitivity testing. The devices can safely withstand a maximum ofthreereflowpassesattheseconditions. Please note that although the X/7343–43 case size can withstand wavesoldering,thetallprofile(4.3mmmaximum)dictatescarein wave process development. Handsolderingshouldbeperformedwithcareduetothedifficulty in process control. If performed, care should be taken to avoid contact of the soldering iron to the molded case. The iron should be used to heat the solder pad, applying solder between the pad andthetermination,untilreflowoccurs.Oncereflowoccurs,the ironshouldberemovedimmediately.“Wiping”theedgesofachip and heating the top surface is not recommended. Duringtypicalreflowoperations,aslightdarkeningofthegold- colored epoxy may be observed. This slight darkening is normal and not harmful to the product. Marking permanency is not affected by this change. Profile Feature SnPb Assembly Pb-Free Assembly Preheat/Soak Temperature Minimum (T Smin) 100°C 150°C Temperature Maximum (T Smax) 150°C 200°C Time (t s) from Tsmin to Tsmax) 60 – 120 seconds 60 – 120 seconds Ramp-up Rate (T L to TP) 3°C/seconds maximum 3°C/seconds maximum Liquidous Temperature (T L) 183°C 217°C Time Above Liquidous (t L) 60 – 150 seconds 60 – 150 seconds Peak Temperature (T P) 220°C* 235°C** 250°C* 260°C** Time within 5°C of Maximum Peak Temperature (t P) 20 seconds maximum 30 seconds maximum Ramp-down Rate (T P to TL) 6°C/seconds maximum 6°C/seconds maximum Time 25°C to Peak Temperature 6 minutes maximum 8 minutes maximum Note: All temperatures refer to the center of the package, measured on the package body surface that is facing up during assembly reflow. *Case Size D, E, P, Y, and X **Case Size A, B, C, H, I, K, M, R, S, T, U, V, W, and Z Construction Silver Adhesive Carbon Silver Paint Tantalum Wire Weld Leadframe (-Cathode) Leadframe (+Anode) Polymer /Ta 2O5/Ta |
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