MS-6-140-Y datasheet(5/282 Pages) ETC2

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MS-6-140-Y Datasheet(PDF) 5 Page - List of Unclassifed Manufacturers

Part #	MS-6-140-Y

Description	High-Speed Interconnect Technology

Download	282 Pages

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Manufacturer	ETC2 [List of Unclassifed Manufacturers]

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1. Button-Only

This is the basic CIN::APSE contact configuration. It is ideally suited for

z-axis applications requiring minimum height, high density, and signal

integrity. This configuration is used in LGA and IC sockets, PCB to PCB,

and flex print circuit to PCB applications.

2. Plunger-Button

The addition of a gold-plated brass plunger increases the durability of the

CIN::APSE contact system while also achieving additional height. This

configuration suits itself especially well for PCB to PCB interconnect and

those that require excessive handling.

CIN::APSE Applications

Due to its breakthrough nature, it is impossible to illustrate all of the applications CIN::APSE

technology can address. The following applications illustrate only a portion of the types of

interconnect problems that CIN::APSE can solve.

TYPICAL CONFIGURATION

CIN::APSE®

High-Speed Interconnect Technology

Other custom configurations are

available. Contact Cinch for details.

1-3

Call Toll Free: 1 (800) 323-9612

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Manufacturer	Part #	Datasheet	Description
Vincotech	10-FZ072PB120SM03-M815F03	1Mb / 18P	High speed IGBT5 technology
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Tyco Electronics	1410142-1	494Kb / 6P	High Speed Backplane Interconnect Solutions
Infineon Technologies A...	IKP30N65H5	2Mb / 17P	High speed H5 technology offering Rev.2.2,2014-12-04
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	SKB06N60HS	356Kb / 14P	High Speed IGBT in NPT-technology Rev. 2.2 June 06
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