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4-141-W Datasheet(PDF) 4 Page - List of Unclassifed Manufacturers

Part No. 4-141-W
Description  High-Speed Interconnect Technology
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Maker  ETC2 [List of Unclassifed Manufacturers]
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The unique construction of the CIN::APSE contact
provides superior mechanical and electrical performance.
It is constructed of randomly wound molybdenum wire that
is formed into a cyclindrical shape. Standard CIN::APSE
contact diameters are 0.020" and 0.040".
Mechanical
• Small form factor (0.020" diameter by 0.32" min. high)
• Low compression force (approx. 2.5 oz. min. per contact)
• Multiple beam structures
• Several points of contact per button
• Extremely lightweight
• Natural wiping action
Electrical
• Short signal path
• Very low inductance and resistance
• Signal integrity tested in the GHz range
Typical CIN::APSE Applications
• LGA package I/O to PC board (IC packages,
multi-chip modules)
• PC board to PC board (parallel processors,
enhancement/mezzanine cards)
• Flex circuit to PC board (rigid flex, harnessing)
• Flex circuit to ceramic (chip to harness)
The basic button contact
configuration consists of a single
button installed in our patented
“hourglass” design.
The hourglass cavity retains the
CIN::APSE contact securely.
Typically 0.003" protrudes from the
top and the bottom of the insulator.
Step 1:
Using alignment features,
position the CIN::APSE
connector between a LGA chip
package and PCB or two PCBs
that have matching footprints.
Step 2:
Add Z-Axis compression
and secure.
THE BUTTON CONTACT
CIN::APSE APPLIED
CIN::APSE®
High-Speed Interconnect Technology
1-2
Call Toll Free: 1 (800) 323-9612




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