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923347 Datasheet(PDF) 1 Page - List of Unclassifed Manufacturers |
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1 / 25 page 1 http://Connect.ERNI.com/contact/ Catalog E 074486 08/00 Edition 1 CompactPCI Connectors acc. to PIGMG 2.0 Rev. 3.0 General Late in 1999 PCI Industrial Computer Manufacturers Group (PICMG) introduced the new revision 3.0 of the Compact- PCI Core Specification. Version 3.0 of this specification comprises a.o. hot swap and computer telephony specifi- cations such as pin sequencing. For CompactPCI, the metric ERmet connectors are specified in accordance with IEC 61076-4-101 which are available in build types A, B, AB, and as monoblock versions. This new version of the CompactPCI specification has the consequence a.o. that for 3 HE backplanes on position P2 a male connector, build type B with long connection pins for AB transfer and AB shrouds are inserted into position rP2. At the rear card end, on position rJ2, a sheilded female connector in build type AB is specified. For 6 HE backplanes, on P3 and P5, the male connector - build type B with long connection pins - for AB transfer and AB shrouds have to be inserted into positions rP3 and rP5. At the rear card end, on positions rJ3 and rJ5, a shielded female connector, build type AB, has been specified here. On P4, a blade contact strip, build type A with long connection pins for A shroud and A shroud frames, has been specified on position rP4. For the rear card end, a shielded female connector, build type A, has been defined on rJ4. For male connectors with shrouds in build types A and B, the specification only requires a series a grounding for the upper screening panel. All necessary connectors required in accordance with the new CompactPCI specification are available from ERNI. In addition, for CompactPCI applications, ERNI also offers an economic solution for a male connector with long terminal pins, which is populated with shield contacts on row a only. In addition to the new AB compatible male connectors for CompactPCI, ERNI also supplies shrouds. Here, all shrouds are available in four different heights (3.9 mm, 4.5 mm, 5.3 mm, and 6.1 mm) in order to adapt to the printed circuit board thickness of the backplanes. |
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