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MAX3372EEBLT Datasheet(PDF) 2 Page - Maxim Integrated Products |
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MAX3372EEBLT Datasheet(HTML) 2 Page - Maxim Integrated Products |
2 / 26 page MAX3372E–MAX3379E/MAX3390E–MAX3393E ±15kV ESD-Protected, 1µA, 16Mbps, Dual/Quad Low-Voltage Level Translators in UCSP 2 Maxim Integrated ABSOLUTE MAXIMUM RATINGS ELECTRICAL CHARACTERISTICS (VCC = +1.65V to +5.5V, VL = +1.2V to (VCC + 0.3V), GND = 0, I/O VL_ and I/O VCC_ unconnected, TA = TMIN to TMAX, unless other- wise noted. Typical values are at VCC = +3.3V, VL = +1.8V, TA = +25°C.) (Notes 1, 2) Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. (All voltages referenced to GND.) VCC ...........................................................................-0.3V to +6V I/O VCC_......................................................-0.3V to (VCC + 0.3V) I/O VL_ ...........................................................-0.3V to (VL + 0.3V) THREE-STATE...............................................-0.3V to (VL + 0.3V) Short-Circuit Duration I/O VL, I/O VCC to GND...........Continuous Short-Circuit Duration I/O VL or I/O VCC to GND Driven from 40mA Source (except MAX3372E and MAX3377E) .....................Continuous Continuous Power Dissipation (TA = +70°C) 8-Pin SOT23 (derate 5.6mW/°C above +70°C)........444.4mW 8-Pin TDFN (derate 18.5mW/°C above +70°C) ........1482mW 3 x 3 UCSP (derate 4.7mW/°C above +70°C) ............379mW 3 x 4 UCSP (derate 6.5mW/°C above +70°C) ............520mW 14-Pin TSSOP (derate 9.1mW/°C above +70°C) ........727mW 14-Pin TDFN (derate 18.5mW/°C above +70°C) ......1482mW Operating Temperature Range ...........................-40°C to +85°C Storage Temperature Range .............................-65°C to +150°C Lead Temperature (soldering, 10s) .................................+300°C Soldering Temperature (reflow) .......................................+260°C PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS POWER SUPPLIES VL Supply Range VL 1.2 5.5 V VCC Supply Range VCC 1.65 5.50 V Supply Current from VCC IQVCC 130 300 µA Supply Current from VL IQVL 16 100 µA VCC Three-State Output Mode Supply Current ITHREE-STATE-VCC TA = +25 °C, THREE-STATE = GND 0.03 1 µA VL Three-State Output Mode Supply Current ITHREE-STATE-VL TA = +25 °C, THREE-STATE = GND 0.03 1 µA Three-State Output Mode Leakage Current I/O VL_ and I/O VCC_ ITHREE-STATE-LKG TA = +25 °C, THREE-STATE = GND 0.02 1 µA THREE-STATE Pin Input LeakageTA = +25 °C 0.02 1 µA ESD PROTECTION IEC 1000-4-2 Air-Gap Discharge ±8 IEC 1000-4-2 Contact Discharge ±8 I/O VCC (Note 3) Human Body Model ±15 kV LOGIC-LEVEL THRESHOLDS (MAX3372E/MAX3377E) I/O VL_ Input-Voltage High VIHL VL - 0.2 V I/O VL_ Input-Voltage Low VILL 0.15 V |
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