3

MX25L1633E

P/N: PM1581

REV. 1.8, NOV. 08, 2013

(15) Deep Power-down (DP)...........................................................................................................................21

(16) Release from Deep Power-down (RDP), Read Electronic Signature (RES) ...........................................21

(17) Read Electronic Manufacturer ID & Device ID (REMS), (REMS2), (REMS4) .........................................22

Table 7. ID Definitions ....................................................................................................................................22

(18) Enter Secured OTP (ENSO)....................................................................................................................22

(19) Exit Secured OTP (EXSO).......................................................................................................................23

(20) Read Security Register (RDSCUR) .........................................................................................................23

Table 8. Security Register Definition ...............................................................................................................23

(21) Write Security Register (WRSCUR).........................................................................................................23

POWER-ON STATE ..................................................................................................................................24

ELECTRICAL SPECIFICATIONS.............................................................................................................25

Absolute Maximum Ratings ............................................................................................................................25

Figure 2. Maximum Negative Overshoot Waveform .......................................................................................25

Capacitance ....................................................................................................................................................25

Figure 3. Maximum Positive Overshoot Waveform .........................................................................................25

Figure 4. Input Test Waveforms and Measurement Level...............................................................................26

Figure 5. Output Loading.................................................................................................................................26

Table 9. DC Characteristics.............................................................................................................................27

Table 10. AC Characteristics ...........................................................................................................................28

Timing Analysis .......................................................................................................................................29

Figure 6. Serial Input Timing ...........................................................................................................................29

Figure 7. Output Timing...................................................................................................................................29

Figure 8. WP# Setup Timing and Hold Timing during WRSR when SRWD=1................................................30

Figure 9. Write Enable (WREN) Sequence (Command 06)............................................................................30

Figure 10. Write Disable (WRDI) Sequence (Command 04)...........................................................................30

Figure 11. Read Identification (RDID) Sequence (Command 9F)...................................................................31

Figure 12. Read Status Register (RDSR) Sequence (Command 05) .............................................................31

Figure 13. Write Status Register (WRSR) Sequence (Command 01)............................................................31

Figure 14. Read Data Bytes (READ) Sequence (Command 03) ...................................................................32

Figure 15. Read at Higher Speed (FAST_READ) Sequence (Command 0B) ...............................................32

Figure 16. 2 x I/O Read Mode Sequence (Command BB)..............................................................................33

Figure 17. 4 x I/O Read Mode Sequence (Command EB)..............................................................................33

Figure 18. 4 x I/O Read enhance performance Mode Sequence (Command EB)..........................................34

Figure 19. Page Program (PP) Sequence (Command 02).............................................................................35

Figure 20. 4 x I/O Page Program (4PP) Sequence (Command 38)...............................................................35

Figure 21. Sector Erase (SE) Sequence (Command 20)...............................................................................36

Figure 22. Block Erase (BE) Sequence (Command D8)................................................................................36

Figure 23. Chip Erase (CE) Sequence (Command 60 or C7)........................................................................36

Figure 24. Deep Power-down (DP) Sequence (Command B9)......................................................................37