3

P/N: PM1614

REV. 1.2, NOV. 28, 2013

MX25L3208E

ELECTRICAL SPECIFICATIONS..............................................................................................................................24

ABSOLUTE MAXIMUM RATINGS ..................................................................................................................... 24

Figure 3.Maximum Negative Overshoot Waveform ........................................................................................... 24

CAPACITANCE TA = 25°C, f = 1.0 MHz............................................................................................................. 24

Figure 4. Maximum Positive Overshoot Waveform ............................................................................................ 24

Figure 5. INPUT TEST WAVEFORMS AND MEASUREMENT LEVEL.............................................................. 25

Figure 6. OUTPUT LOADING ........................................................................................................................... 25

Table 8. DC CHARACTERISTICS...................................................................................................................... 26

Table 9. AC CHARACTERISTICS...................................................................................................................... 27

Timing Analysis ........................................................................................................................................................28

Figure 7. Serial Input Timing .............................................................................................................................. 28

Figure 8. Output Timing...................................................................................................................................... 28

Figure 9. Hold Timing ......................................................................................................................................... 29

Figure 10. WP# Disable Setup and Hold Timing during WRSR when SRWD=1 ............................................... 29

Figure 11. Write Enable (WREN) Sequence (Command 06) ............................................................................. 30

Figure 12. Write Disable (WRDI) Sequence (Command 04).............................................................................. 30

Figure 13. Read Status Register (RDSR) Sequence (Command 05) ................................................................ 31

Figure 14. Write Status Register (WRSR) Sequence (Command 01)............................................................... 31

Figure 15. Read Data Bytes (READ) Sequence (Command 03) ...................................................................... 31

Figure 16. Read at Higher Speed (FAST_READ) Sequence (Command 0B)................................................... 32

Figure 17. Dual Output Read Mode Sequence (Command 3B)......................................................................... 33

Figure 18. Sector Erase (SE) Sequence (Command 20).................................................................................. 33

Figure 19. Block Erase (BE) Sequence (Command 52 or D8).......................................................................... 33

Figure 20. Chip Erase (CE) Sequence (Command 60 or C7)........................................................................... 34

Figure 21. Page Program (PP) Sequence (Command 02)................................................................................ 34

Figure 22. Deep Power-down (DP) Sequence (Command B9)......................................................................... 35

Figure 23. Release from Deep Power-down (RDP) Sequence (Command AB) ............................................... 35

Figure 24. Read Electronic Signature (RES) Sequence (Command AB).......................................................... 35

Figure 25. Read Identification (RDID) Sequence (Command 9F)...................................................................... 36

Figure 26. Read Electronic Manufacturer & Device ID (REMS) Sequence (Command 90).............................. 36

Figure 27. Program/Erase flow with read array data.......................................................................................... 37

Figure 28. Power-up Timing ............................................................................................................................... 38

Table 10. Power-Up Timing ............................................................................................................................... 38

OPERATING CONDITIONS.......................................................................................................................................39

Figure 29. AC Timing at Device Power-Up......................................................................................................... 39

Figure 30. Power-Down Sequence .................................................................................................................... 40

ERASE AND PROGRAMMING PERFORMANCE .................................................................................................... 41

DATA RETENTION ....................................................................................................................................................41

LATCH-UP CHARACTERISTICS ..............................................................................................................................41