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MX25L6406EMI12G Datasheet(PDF) 3 Page - Macronix International

Part # MX25L6406EMI12G
Description  64M-BIT [x 1 / x 2] CMOS SERIAL FLASH
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Manufacturer  MCNIX [Macronix International]
Direct Link  http://www.macronix.com
Logo MCNIX - Macronix International

MX25L6406EMI12G Datasheet(HTML) 3 Page - Macronix International

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MX25L6406E
P/N: PM1577
REV. 1.8, NOV. 12, 2013
10-20. Read SFDP Mode (RDSFDP)................................................................................................................. 24
Figure 3. Read Serial Flash Discoverable Parameter (RDSFDP) Sequence................................................... 24
Table 8. Signature and Parameter Identification Data Values ......................................................................... 25
Table 9. Parameter Table (0): JEDEC Flash Parameter Tables ....................................................................... 26
Table 10. Parameter Table (1): Macronix Flash Parameter Tables .................................................................. 28
11. POWER-ON STATE .............................................................................................................................................30
12. ELECTRICAL SPECIFICATIONS........................................................................................................................31
12-1. Absolute Maximum Ratings....................................................................................................................... 31
Figure 4. Maximum Negative Overshoot Waveform ........................................................................................ 31
12-2. Capacitance .............................................................................................................................................. 31
Figure 5. Maximum Positive Overshoot Waveform .......................................................................................... 31
Figure 6. Input Test Waveforms and Measurement Level................................................................................ 32
Figure 7. Output Loading.................................................................................................................................. 32
Table 11. DC Characteristics............................................................................................................................ 33
Table 12. AC Characteristics ............................................................................................................................ 34
13. Timing Analysis ..................................................................................................................................................35
Figure 8. Serial Input Timing ............................................................................................................................ 35
Figure 9. Output Timing.................................................................................................................................... 35
Figure 10. Hold Timing ..................................................................................................................................... 36
Figure 11. WP# Disable Setup and Hold Timing during WRSR when SRWD=1.............................................. 36
Figure 12. Write Enable (WREN) Sequence (Command 06)........................................................................... 37
Figure 13. Write Disable (WRDI) Sequence (Command 04)............................................................................ 37
Figure 14. Read Status Register (RDSR) Sequence (Command 05) .............................................................. 38
Figure 15. Write Status Register (WRSR) Sequence (Command 01)............................................................. 38
Figure 16. Read Data Bytes (READ) Sequence (Command 03) .................................................................... 38
Figure 17. Read at Higher Speed (FAST_READ) Sequence (Command 0B) ................................................ 39
Figure 18. Dual Output Read Mode Sequence (Command 3B)....................................................................... 40
Figure 19. Sector Erase (SE) Sequence (Command 20)................................................................................ 40
Figure 20. Block Erase (BE) Sequence (Command 52 or D8)........................................................................ 40
Figure 21. Chip Erase (CE) Sequence (Command 60 or C7)......................................................................... 41
Figure 22. Page Program (PP) Sequence (Command 02).............................................................................. 41
Figure 23. Deep Power-down (DP) Sequence (Command B9)....................................................................... 42
Figure 24. Release from Deep Power-down (RDP) Sequence (Command AB) ............................................. 42
Figure 25. Read Electronic Signature (RES) Sequence (Command AB)........................................................ 42
Figure 26. Read Identification (RDID) Sequence (Command 9F).................................................................... 43
Figure 27. Read Electronic Manufacturer & Device ID (REMS) Sequence (Command 90)............................ 43
Figure 28. Read Security Register (RDSCUR) Sequence (Command 2B)...................................................... 44
Figure 29. Write Security Register (WRSCUR) Sequence (Command 2F) ..................................................... 44
Figure 30. Program/ Erase flow with read array data....................................................................................... 45
Figure 31. Power-up Timing ............................................................................................................................. 46
Table 13. Power-Up Timing ............................................................................................................................. 46


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