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MX25L6406EMI12G Datasheet(PDF) 3 Page - Macronix International |
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MX25L6406EMI12G Datasheet(HTML) 3 Page - Macronix International |
3 / 60 page 3 MX25L6406E P/N: PM1577 REV. 1.8, NOV. 12, 2013 10-20. Read SFDP Mode (RDSFDP)................................................................................................................. 24 Figure 3. Read Serial Flash Discoverable Parameter (RDSFDP) Sequence................................................... 24 Table 8. Signature and Parameter Identification Data Values ......................................................................... 25 Table 9. Parameter Table (0): JEDEC Flash Parameter Tables ....................................................................... 26 Table 10. Parameter Table (1): Macronix Flash Parameter Tables .................................................................. 28 11. POWER-ON STATE .............................................................................................................................................30 12. ELECTRICAL SPECIFICATIONS........................................................................................................................31 12-1. Absolute Maximum Ratings....................................................................................................................... 31 Figure 4. Maximum Negative Overshoot Waveform ........................................................................................ 31 12-2. Capacitance .............................................................................................................................................. 31 Figure 5. Maximum Positive Overshoot Waveform .......................................................................................... 31 Figure 6. Input Test Waveforms and Measurement Level................................................................................ 32 Figure 7. Output Loading.................................................................................................................................. 32 Table 11. DC Characteristics............................................................................................................................ 33 Table 12. AC Characteristics ............................................................................................................................ 34 13. Timing Analysis ..................................................................................................................................................35 Figure 8. Serial Input Timing ............................................................................................................................ 35 Figure 9. Output Timing.................................................................................................................................... 35 Figure 10. Hold Timing ..................................................................................................................................... 36 Figure 11. WP# Disable Setup and Hold Timing during WRSR when SRWD=1.............................................. 36 Figure 12. Write Enable (WREN) Sequence (Command 06)........................................................................... 37 Figure 13. Write Disable (WRDI) Sequence (Command 04)............................................................................ 37 Figure 14. Read Status Register (RDSR) Sequence (Command 05) .............................................................. 38 Figure 15. Write Status Register (WRSR) Sequence (Command 01)............................................................. 38 Figure 16. Read Data Bytes (READ) Sequence (Command 03) .................................................................... 38 Figure 17. Read at Higher Speed (FAST_READ) Sequence (Command 0B) ................................................ 39 Figure 18. Dual Output Read Mode Sequence (Command 3B)....................................................................... 40 Figure 19. Sector Erase (SE) Sequence (Command 20)................................................................................ 40 Figure 20. Block Erase (BE) Sequence (Command 52 or D8)........................................................................ 40 Figure 21. Chip Erase (CE) Sequence (Command 60 or C7)......................................................................... 41 Figure 22. Page Program (PP) Sequence (Command 02).............................................................................. 41 Figure 23. Deep Power-down (DP) Sequence (Command B9)....................................................................... 42 Figure 24. Release from Deep Power-down (RDP) Sequence (Command AB) ............................................. 42 Figure 25. Read Electronic Signature (RES) Sequence (Command AB)........................................................ 42 Figure 26. Read Identification (RDID) Sequence (Command 9F).................................................................... 43 Figure 27. Read Electronic Manufacturer & Device ID (REMS) Sequence (Command 90)............................ 43 Figure 28. Read Security Register (RDSCUR) Sequence (Command 2B)...................................................... 44 Figure 29. Write Security Register (WRSCUR) Sequence (Command 2F) ..................................................... 44 Figure 30. Program/ Erase flow with read array data....................................................................................... 45 Figure 31. Power-up Timing ............................................................................................................................. 46 Table 13. Power-Up Timing ............................................................................................................................. 46 |
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