3

P/N: PM1613

REV. 1.4, NOV. 06, 2013

MX25L8006E

(20) Read SFDP Mode (RDSFDP)..................................................................................................................... 24

Read Serial Flash Discoverable Parameter (RDSFDP) Sequence.................................................................... 24

Table a. Signature and Parameter Identification Data Values ........................................................................... 25

Table b. Parameter Table (0): JEDEC Flash Parameter Tables ......................................................................... 26

Table c. Parameter Table (1): Macronix Flash Parameter Tables....................................................................... 28

POWER-ON STATE ...................................................................................................................................................30

ELECTRICAL SPECIFICATIONS..............................................................................................................................31

ABSOLUTE MAXIMUM RATINGS ..................................................................................................................... 31

Figure 3. Maximum Negative Overshoot Waveform .......................................................................................... 31

CAPACITANCE TA = 25°C, f = 1.0 MHz............................................................................................................. 31

Figure 4. Maximum Positive Overshoot Waveform ............................................................................................ 31

Figure 5. INPUT TEST WAVEFORMS AND MEASUREMENT LEVEL.............................................................. 32

Figure 6. OUTPUT LOADING ........................................................................................................................... 32

Table 8. DC CHARACTERISTICS...................................................................................................................... 33

Table 9. AC CHARACTERISTICS...................................................................................................................... 34

Timing Analysis ........................................................................................................................................................35

Figure 7. Serial Input Timing .............................................................................................................................. 35

Figure 8. Output Timing...................................................................................................................................... 35

Figure 9. Hold Timing ......................................................................................................................................... 36

Figure 10. WP# Disable Setup and Hold Timing during WRSR when SRWD=1 ............................................... 36

Figure 11. Write Enable (WREN) Sequence (Command 06) ............................................................................. 37

Figure 12. Write Disable (WRDI) Sequence (Command 04).............................................................................. 37

Figure 13. Read Status Register (RDSR) Sequence (Command 05) ................................................................ 38

Figure 14. Write Status Register (WRSR) Sequence (Command 01)............................................................... 38

Figure 15. Read Data Bytes (READ) Sequence (Command 03) ...................................................................... 38

Figure 16. Read at Higher Speed (FAST_READ) Sequence (Command 0B)................................................... 39

Figure 17. Dual Output Read Mode Sequence (Command 3B)......................................................................... 40

Figure 18. Sector Erase (SE) Sequence (Command 20).................................................................................. 40

Figure 19. Block Erase (BE) Sequence (Command 52 or D8).......................................................................... 40

Figure 20. Chip Erase (CE) Sequence (Command 60 or C7)........................................................................... 41

Figure 21. Page Program (PP) Sequence (Command 02)................................................................................ 41

Figure 22. Deep Power-down (DP) Sequence (Command B9)......................................................................... 42

Figure 23. Release from Deep Power-down (RDP) Sequence (Command AB) ............................................... 42

Figure 24. Read Electronic Signature (RES) Sequence (Command AB).......................................................... 42

Figure 25. Read Identification (RDID) Sequence (Command 9F)...................................................................... 43

Figure 26. Read Electronic Manufacturer & Device ID (REMS) Sequence (Command 90).............................. 43

Figure 27. Read Security Register (RDSCUR) Sequence (Command 2B)........................................................ 44

Figure 28. Write Security Register (WRSCUR) Sequence (Command 2F) ....................................................... 44

Figure 29. Power-up Timing ............................................................................................................................... 45