3

MX25U5121E

MX25U1001E

P/N: PM1980

REV. 0.00, OCT. 11, 2013

ADVANCED INFORMATION

Figure3.Program/Eraseflowwithreadarraydata .................................................................................... 20

12. ELECTRICAL SPECIFICATIONS........................................................................................................................21

12-1. ABSOLUTE MAXIMUM RATINGS .......................................................................................................... 21

Figure 4. Maximum Negative Overshoot Waveform................................................................................... 21

12-2. CAPACITANCE TA = 25°C, f = 1.0 MHz .................................................................................................. 21

Figure 5. Maximum Positive Overshoot Waveform .................................................................................... 21

Figure 6. Input Test Waveforms and Measurement Level .......................................................................... 22

Figure 7. Output Loading............................................................................................................................ 22

Table 8. DC CHARACTERISTICS ........................................................................................................... 23

Table 9. AC CHARACTERISTICS .......................................................................................................... 24

13. Timing Analysis ..................................................................................................................................................25

Figure 8. Serial Input Timing....................................................................................................................... 25

Figure 9. Output Timing .............................................................................................................................. 25

Figure 10. WP# Disable Setup and Hold Timing during WRSR when SRWD=1........................................ 26

Figure 11. Write Enable (WREN) Sequence (Command 06)...................................................................... 26

Figure 12. Write Disable (WRDI) Sequence (Command 04)...................................................................... 26

Figure13.ReadIdentification(RDID)Sequence(Command9F) .............................................................. 27

Figure 14. Read Status Register (RDSR) Sequence (Command 05) ........................................................ 28

Figure 15. Write Status Register (WRSR) Sequence (Command 01)....................................................... 28

Figure 16. Read Data Bytes (READ) Sequence (Command 03)............................................................... 28

Figure 17. Read at Higher Speed (FAST_READ) Sequence (Command 0B)........................................... 29

Figure 18. Dual Read Mode Sequence (Command 3B)............................................................................. 29

Figure 19. 4 x I/O Read Mode Sequence (Command EB) ......................................................................... 30

Figure 20. Sector Erase (SE) Sequence (Command 20) .......................................................................... 30

Figure 21. Block Erase (BE) Sequence (Command D8 or 52) .................................................................. 31

Figure 22. Chip Erase (CE) Sequence (Command 60 or C7) ................................................................... 31

Figure 23. Page Program (PP) Sequence (Command 02)........................................................................ 31

Figure 24. Deep Power Down (DP) Sequence (Command B9) ................................................................. 32

Figure 25. Release from Deep Power Down (RDP) Sequence (Command AB) ........................................ 32

Figure 26. Power-Up Timing....................................................................................................................... 33

Table 10. Power-Up Timing...................................................................................................................... 33

13-1. INITIAL DELIVERY STATE ...................................................................................................................... 33

14. OPERATING CONDITIONS.................................................................................................................................34

Figure 27. AC Timing at Device Power-Up ................................................................................................. 34

Figure 28. Power-Down Sequence............................................................................................................. 35

15. ERASE AND PROGRAMMING PERFORMANCE .............................................................................................. 36

17. DATA RETENTION .............................................................................................................................................36

16. LATCH-UP CHARACTERISTICS ........................................................................................................................36

18. ORDERING INFORMATION................................................................................................................................37

19. PART NAME DESCRIPTION...............................................................................................................................38

20. PACKAGE INFORMATION..................................................................................................................................39