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ADG3247BRU-REEL7 Datasheet(PDF) 3 Page - Analog Devices

Part # ADG3247BRU-REEL7
Description  2.5 V/3.3 V, 16-Bit, 2-Port Level Translating, Bus Switch
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Manufacturer  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

ADG3247BRU-REEL7 Datasheet(HTML) 3 Page - Analog Devices

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REV. 0
ADG3247
–3–
ABSOLUTE MAXIMUM RATINGS
*
(TA = 25
°C, unless otherwise noted.)
VCC to GND . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to +4.6 V
Digital Inputs to GND . . . . . . . . . . . . . . . . . –0.5 V to +4.6 V
DC Input Voltage . . . . . . . . . . . . . . . . . . . . . –0.5 V to +4.6 V
DC Output Current . . . . . . . . . . . . . . . . . . 25 mA per channel
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . . . –40
°C to +85°C
Storage Temperature Range . . . . . . . . . . . . –65
°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150
°C
LFCSP Package
θ
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . . 32
°C/W
TSSOP Package
θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 98°C/W
Lead Temperature, Soldering (10 seconds) . . . . . . . . . . 300
°C
IR Reflow, Peak Temperature (<20 seconds) . . . . . . . . 235
°C
*Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the opera tional
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability. Only one absolute
maximum rating may be applied at any one time.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although the
ADG3247 features proprietary ESD protection circuitry, permanent damage may occur on devices
subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended
to avoid performance degradation or loss of functionality.
Table I. Pin Description
Mnemonic
Description
BEx
Bus Enable (Active Low)
SEL
Level Translation Select
Ax
Port A, Inputs or Outputs
Bx
Port B, Inputs or Outputs
Table II. Truth Table
BEx SEL* Function
LL
A = B, 3.3 V to 1.8 V Level Shifting
LH
A = B, 3.3 V to 2.5 V/2.5 V to 1.8 V Level Shifting
HX
Disconnect
*SEL = 0 only when VDD = 3.3 V
± 10%
PIN CONFIGURATION
40-Lead LFCSP and 38-Lead TSSOP
PIN 1
INDICATOR
TOP VIEW
ADG3247
1
2
3
4
5
6
7
8
9
10
NC = NO CONNECT
30 B0
29 B1
28 B2
27 B3
26 B4
25 B5
24 B6
23 B7
22 B8
21 B9
A6
A7
A8
A9
A10
A11
A12
A13
A14
A15
TOP VIEW
(Not to Scale)
38
37
36
35
34
33
32
1
2
3
4
5
6
7
A0
A1
A2
A3
A4
A5
VCC
BE1
BE2
SEL
B0
B1
B2
B3
ADG3247
31
30
29
8
9
10
A6
A7
A8
B4
B5
B6
28
27
11
12
A9
A10
A11
A12
A13
A14
A15
B7
B8
26
25
B9
B10
B11
B12
B13
B14
B15
24
23
22
17
21
20
18
19
GND
NC
13
14
15
16
NC = NO CONNECT
ORDERING GUIDE
Model
Temperature Range
Package Description
Package Option
ADG3247BCP
–40
°C to +85°CLead Frame Chip Scale Package (LFCSP)
CP-40
ADG3247BCP-REEL7
–40
°C to +85°CLead Frame Chip Scale Package (LFCSP)
CP-40
ADG3247BRU
–40
°C to +85°CThin Shrink Small Outline Package (TSSOP)
RU-38
ADG3247BRU-REEL7
–40
°C to +85°CThin Shrink Small Outline Package (TSSOP)
RU-38


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