FEDL610Q428-03

ML610Q428/ML610Q429

9/33

ML610Q429 Chip Dimension

31

SEG11

32

SEG12

33

SEG13

34

SEG14

35

SEG15

36

SEG16

37

SEG17

38

SEG18

39

SEG19

40

SEG20

41

SEG21

42

SEG22

43

SEG23

44

SEG24

45

SEG25

46

SEG26

47

SEG27

48

SEG28

49

SEG29

50

SEG30

51

SEG31

52

SEG32

53

SEG33

54

SEG34

55

SEG35

56

SEG36

57

SEG37

58

SEG38

59

SEG39

60

SEG40

61

SEG41

62

SEG42

94

P20

95

P21

96

P22

97

P40

98

P41

99

VPP

100

RESET_N

101

P44

102

P45

103

P46

104

P47

105

P30

106

P31

107

P34

108

P32

109

P33

110

P35

111

TEST

112

VDD

113

VDDL

114

VSS

115

VDDX

116

XT0

117

XT1

118

P42

119

P43

120

VL1

121

VL2

122

VL3

123

VL4

124

C1

125

C2

428

ZF8

Device Name

"428"

Device Name

"ZF8"

Chip size:

2.99 mm

× 3.11 mm

PAD count:

125 pins

Minimum PAD pitch:

80

µm

PAD aperture:

70

µm × 70 µm

Chip thickness:

350

µm

Voltage of the rear side of chip:

Figure 5 ML610Q429 Chip Dimension

Note:

Figure 5 is an image figure of the order of PAD, and it differs from an actual image. Refer to the PAD coordinate for detailed

arrangement.

A chip angle can be checked by the distinguishing mark of three figures.