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MR36V02G54B Datasheet(PDF) 9 Page - List of Unclassifed Manufacturers

Part # MR36V02G54B
Description  64M?밯ord32?밄it Page Mode P2ROM
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NOTICE
No copying or reproduction of this document, in part or in whole, is permitted without the consent of LAPIS
Semiconductor Co., Ltd.
The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing LAPIS Semiconductor's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be
obtained from LAPIS Semiconductor upon request.
Examples of application circuits, circuit constants and any other information contained herein illustrate the
standard usage and operations of the Products. The peripheral conditions must be taken into account when
designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document. However, should
you incur any damage arising from any inaccuracy or misprint of such information, LAPIS Semiconductor shall
bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and examples of
application circuits for the Products. LAPIS Semiconductor does not grant you, explicitly or implicitly, any
license to use or exercise intellectual property or other rights held by LAPIS Semiconductor and other parties.
LAPIS Semiconductor shall bear no responsibility whatsoever for any dispute arising from the use of such
technical information.
The Products specified in this document are intended to be used with general-use electronic equipment or devices
(such as audio visual equipment, office-automation equipment, communication devices, electronic appliances
and amusement devices).
The Products specified in this document are not designed to be radiation tolerant.
While LAPIS Semiconductor always makes efforts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard against the
possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as
derating, redundancy, fire control and fail-safe designs. LAPIS Semiconductor shall bear no responsibility
whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction
manual.
The Products are not designed or manufactured to be used with any equipment, device or system which requires
an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human
life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace
machinery, nuclear-reactor controller, fuel-controller or other safety device). LAPIS Semiconductor shall bear
no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended
to be used for any such special purpose, please contact a ROHM sales representative before purchasing.
If you intend to export or ship overseas any Product or technology specified herein that may be controlled under
the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the
Law.
Copyright 2008 - 2011 LAPIS Semiconductor Co., Ltd.


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