80

Revised: July 12, 2010

© 2010 Littelfuse, Inc.

30R Series

Radial Leaded > 30R Series

Specifications are subject to change without notice.

Please refer to www.littelfuse.com/series/30R.html for current information.

Dimension

EIA Mark

IEC Mark

Dimensions

Dim. (mm)

Tol. (mm)

Carrier tape width

WW

18

-0.5 / +1.0

Hold down tape width:

W

4

W

0

11

min.

Top distance between tape edges

W

6

W

2

3

max.

Sprocket hole position

W

5

W

1

9

-0.5 / +0.75

Sprocket hole diameter*

D

0

D

0

4

-0.32 / +0.2

Abscissa to plane(straight lead)

HH

18.5

-/+ 3.0

Abscissa to plane(kinked lead)

H

0

H

0

16

-/+ 0.5

Abscissa to top: 30R090-30R185

H

1

H

1

32.2

max.

Abscissa to top: 30R250-30R900

45.0

max.

Overall width w/o lead protrusion: 30R090-30R185

C

1

42.5

max.

Overall width w/o lead protrusion: 30R250-30R900

56

max.

Overall width w/ lead protrusion: 30R090-30R185

C

2

43.2

max.

Overall width w/ lead protrusion: 30R250-30R900

57

max.

Lead protrusion

L

1

l

1

1.0

max.

Protrusion of cut out

LL

11

max.

Protrusion beyond hold–down tape

l

2

l

2

Not specified

Sprocket hole pitch: 30R090-30R300

P

0

P

0

12.7

-/+ 0.3

Sprocket hole pitch on: 30R400-30R900

P

0

P

0

25.4

-/+ 0.5

Device pitch: 30R090-30R300

12.7

Device pitch: 30R400-30R900

25.4

Pitch tolerance

20 consecutive.

-/+ 1

Tape thickness

tt

0.9

max.

Tape thickness with splice: 30R090-30R250

t

1

1.5

max.

Tape thickness with splice: 30R300-30R900

t

1

2.0

max.

Splice sprocket hole alignment

0

-/+ 0.3

Body lateral deviation

Δh

Δh

0

-/+ 1.0

Body tape plane deviation

Δp

Δp

0

-/+ 1.3

Ordinate to adjacent component lead*

P

1

P

1

3.81

-/+ 0.7

Ordinate to adjacent component lead*

7.62

-/+ 0.7

Lead spacing: 30R090–30R400

FF

5.08

-/+ 0.8

Lead spacing: 30R500-30R900

FF

10.18

-/+ 0.8

Tape and Ammo Specifications

Devices taped using EIA468-B/IE286-2 standards. See table below and Figure 1 for details.

*Differs from EIA Specification