THS4211

THS4215

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

ABSOLUTE MAXIMUM RATINGS

Over operating free-air temperature range (unless otherwise noted).

(1)

UNIT

16.5 V

250 mA

Continuous power dissipation

See Dissipation Ratings Table

(2)

+150°C

(3)

+125°C

–65°C to +150°C

HBM

4000 V

ESD ratings

CDM

1500 V

MM

200 V

(1)

Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may

degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond

those specified is not implied.

(2)

The absolute maximum ratings under any condition is limited by the constraints of the silicon process. Stresses above these ratings may

cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are

stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied.

(3)

The maximum junction temperature for continuous operation is limited by package constraints. Operation above this temperature may

result in reduced reliability and/or lifetime of the device.

PACKAGE DISSIPATION RATINGS

(1)

(2)

PACKAGE

(°C/W)

(°C/W)

D (8-pin)

38.3

97.5

1.02 W

410 mW

4.7

58.4

1.71 W

685 mW

DGK (8-pin)

54.2

260

385 mW

154 mW

DRB (8-pin)

5

45.8

2.18 W

873 mW

(1)

The THS4211/5 may incorporate a PowerPAD™ on the underside of the chip. This acts as a heat sink and must be connected to a

thermally dissipative plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction temperature

which could permanently damage the device. See TI technical briefs SLMA002 and SLMA004 for more information about utilizing the

PowerPAD thermally enhanced package.

(2)

This data was taken using the JEDEC standard High-K test PCB.

(3)

Power rating is determined with a junction temperature of +125°C. This is the point where distortion starts to substantially increase.

Thermal management of the final PCB should strive to keep the junction temperature at or below +125°C for best performance and long

term reliability.

RECOMMENDED OPERATING CONDITIONS

MIN

MAX

UNIT

Dual supply

±2.5

±7.5

V

Single supply

5

15

Input common-mode voltage range

V

2

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