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59629553601QPA Datasheet(PDF) 3 Page - National Semiconductor (TI) |
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59629553601QPA Datasheet(HTML) 3 Page - National Semiconductor (TI) |
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3 / 31 page  LM7171QML, LM7171QML-SP www.ti.com SNOSAR5C – FEBRUARY 2009 – REVISED APRIL 2013 Absolute Maximum Ratings (1) Supply Voltage (V+–V−) 36V Differential Input Voltage(2) ±10V Maximum Power Dissipation(3) 730mW Output Short Circuit to Ground(4) Continuous Storage Temperature Range −65°C ≤ TA ≤ +150°C Thermal Resistance(5) θJA 8LD CDIP (Still Air) 106°C/W 8LD CDIP (500LF/Min Air flow) 53°C/W 10LD CFP (Still Air) 182°C/W 10LD CFP (500LF/Min Air flow) 105°C/W 10LD CFP "WG" (device 01, 02) (Still Air) 182°C/W 10LD CFP "WG" (device 01, 02) (500LF/Min Air flow) 105°C/W θJC 8LD CDIP 3°C/W 10LD CFP 5°C/W 10LD CFP "WG" (device 01, 02)(6) 5°C/W Package Weight (Typical) 8LD CDIP 965mg 10LD CFP 235mg 10LD CFP "WG" (device 01, 02) 230mg Maximum Junction Temperature(3) 150°C ESD Tolerance(7) 3000V (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not guarantee specific performance limits. For specified specifications and test conditions, see the Electrical Characteristics. The specified specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. (2) Differential input voltage is applied at VS = ±15V. (3) The maximum power dissipation must be derated at elevated temperatures and is dictated by TJmax (maximum junction temperature), θJA (package junction to ambient thermal resistance), and TA (ambient temperature). The maximum allowable power dissipation at any temperature is PDmax = (TJmax - TA)/θJA or the number given in the Absolute Maximum Ratings, whichever is lower. (4) Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in exceeding the maximum allowed junction temperature of 150°C. (5) All numbers apply for packages soldered directly into a PC board. (6) The package material for these devices allows much improved heat transfer over our standard ceramic packages. In order to take full advantage of this improved heat transfer, heat sinking must be provided between the package base (directly beneath the die), and either metal traces on, or thermal vias through, the printed circuit board. Without this additional heat sinking, device power dissipation must be calculated using θJA, rather than θJC, thermal resistance. It must not be assumed that the device leads will provide substantial heat transfer out the package, since the thermal resistance of the leadframe material is very poor, relative to the material of the package base. The stated θJC thermal resistance is for the package material only, and does not account for the additional thermal resistance between the package base and the printed circuit board. The user must determine the value of the additional thermal resistance and must combine this with the stated value for the package, to calculate the total allowed power dissipation for the device. (7) Human body model, 1.5 k Ω in series with 100 pF. Recommended Operating Conditions (1) Supply Voltage 5.5V ≤ VS ≤ 36V Operating Temperature Range −55°C ≤ TA ≤ +125°C (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not guarantee specific performance limits. For specified specifications and test conditions, see the Electrical Characteristics. The specified specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. Copyright © 2009–2013, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: LM7171QML LM7171QML-SP |
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